Pneumatic Dual-lane Stencil Cleaner SMT Printer Stencil Cleaning Machine BC310D
The BC310D is a pneumatic dual-chamber SMT stencil cleaning machine designed for high‑efficiency cleaning of solder paste and red glue stencils. With two independent cleaning systems, 1μm filtration, and fully pneumatic operation, it delivers maximum productivity, safety, and long-term reliability for SMT production lines.
✅ Dual independent cleaning systems clean 2 stencils simultaneously
✅ 100% pneumatic operation (no electricity required)
✅ 360° high-pressure spray cleaning system
✅ Compatible with solvent and water-based cleaning liquids
✅ Improve SMT printing quality & reduce defects
Pneumatic SMT Stencil Cleaner | Solder Paste Stencil Cleaning Machine BC310
The BC310 Pneumatic Stencil Cleaner is designed for fast, safe, and efficient cleaning of SMT stencils, removing solder paste and flux residue to ensure consistent printing performance and higher yield.
✅ 100% pneumatic operation (no electricity required)
✅ 360° high-pressure spray cleaning system
✅ Compatible with solvent and water-based cleaning liquids
✅ Improve SMT printing quality & reduce defects
Reflow Oven Condenser Chiller Cleaning Machine for SMT Production Line Maintenance BC220
BC210 Pallet Cleaning Machine for wave soldering pallet, reflow oven condensers chiller, claws, chains, filters and PCBA tooling. PLC control, water‑based chemcial liquid cleaning, full‑coverage spray, tape water / DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
SC720 IGBT Inline Ultrasonic Cleaning Machine | Lead Frame Flux Cleaning Equipment
The SC720 IGBT Inline Ultrasonic Cleaning Machine is specially designed for automated cleaning of IGBT modules, IPM (Intelligent Power Modules), and leadframe-based semiconductor packages.
Using a combination of multi-stage ultrasonic cleaning, spray cleaning, and DI water rinsing technology, the system effectively removes flux residues, organic contaminants, and process residues generated during semiconductor packaging processes.
With a fully automated loading and unloading system, SC720 provides a reliable cleaning solution for high-volume semiconductor manufacturing, improving product cleanliness, reliability, and production efficiency.
SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner FC820
FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs.
As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures.
Typical cleaning challenges include:
- Flux trapped under ultra-low standoff gap;
- Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages;
- Ionic contamination affecting reliability;
- Cleaning consistency in high-volume inline production.The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.
SMT Squeegee Auto Cleaning Machine Solder Paste Squeegee Blade Cleaner BC410
The BC410 Squeegee Cleaning Machine features an integrated ultrasonic and spray cleaning system. It follows a standard three-step workflow: washing with water-based solder paste cleaning fluid, rinsing with DI water, and hot air drying. Each batch can clean 6 to 12 squeegees efficiently.
During operation, the squeegees are securely mounted on a special synchronous rotating fixture. This rotating design ensures thorough cleaning of all surfaces, including squeegee gaps, fixture contact areas, and both ends, achieving dead-angle-free cleaning. The result is complete removal of solder paste residues, restoring the squeegees' accuracy for immediate reuse in production.
UC-250BV SMT PCB Surface Cleaning Machine Inline Bare PCB Dust & Static Removal System
UC-250M-CV SMT PCB Surface Cleaning Machine Inline Bare PCB Dust & Static Removal System
UC-250M-C integrates two distinct cleaning mechanisms: "Rotary Brush + Vacuum" and "Sticky Roller + Tack Roll." The system offers flexible operation modes, allowing both functions to run simultaneously or independently based on specific process requirements.
Brush Cleaning System: Effectively removes particulates and larger foreign debris from the PCB surface.
Roller Cleaning System: Targets micro-dust and electrostatically adsorbed particles for deep cleaning.
