FC720 is a new-generation inline spray cleaning machine independently designed and manufactured by ACTSPRAY for automatic flux residue removal from PCBA assemblies, SiP modules and low-gap flip chip packages.
The system combines multi-stage chemical spray cleaning, chemical isolation, multi-stage DI water rinsing, air knife and hot air drying in one continuous inline process. Special spray nozzle combinations and adjustable upper/lower spray systems help cleaning liquids penetrate narrow gaps and remove flux residues from densely populated PCBA assemblies and low-standoff semiconductor packages.
With a 600 mm-wide stainless steel mesh conveyor, adjustable conveyor speed and fully monitored cleaning parameters, FC720 provides a stable and repeatable cleaning process for automated electronics and semiconductor packaging production lines.
Key Applications: PCBA Cleaning | SiP Cleaning | Flip Chip Cleaning | FCBGA Cleaning | FCCSP Cleaning | Low-Gap Package Cleaning | Flux Residue Removal JEDEC Tray Cleaning | DI Water Spray Wash | DI Water Rinse | Air Drying| Hot Air Drying | 600 mm Conveyor | SMEMA Integration | Optional MES
The DC260 provides an automated and repeatable cleaning solution for reusable JEDEC trays, combining DI water spray washing, DI water rinsing, filtered air blow drying and hot air drying in one inline machine.
Its 600 mm conveyor width accommodates large JEDEC trays, while adjustable conveyor speed and spray pressure allow the cleaning process to be optimized for different production requirements.
For automated semiconductor manufacturing lines, SMEMA connectivity enables integration with tray loaders, unloaders and conveyors. Optional MES connectivity provides an additional solution for factory-level production monitoring.
The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.
Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.
With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.
The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.
Real-world cleaning applications and process trials from PCBA, SMT and semiconductor manufacturing.
Explore cleaning challenges, equipment configurations, process parameters and test results from actual applications.
