PCBA Cleaning Machine Manufacturer | Inline & Batch Flux Cleaning Equipment.
PCBA Cleaning Machine Manufacturer | Inline & Batch Flux Cleaning Equipment.
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    • PCBA Cleaning
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      AC530 Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal

      AC530 Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal

      PCBA Cleaning, Batch
      The AC530 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
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      AC510 PCBA cleaning machine, automatic PCBA flux cleaner, batch type PCB cleaning equipment, industrial electronic assembly cleaner, SMT/THT PCBA cleaning machine
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      Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal AC510

      PCBA Cleaning, Batch
      The AC510 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
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      PCBA Inline DI Water Washing Cleaning System for Removing Water-Soluble Flux BC560
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      BC560 PCBA Inline DI Water Washing Cleaning System for Removing Water-Soluble Flux

      PCBA Cleaning, Inline
      BC560 is a fully automatic inline DI water cleaning machine for PCBA. It is suitable for large batches cleaning of water-soluble flux residues on PCBA and widely used in industries including automotive electronics, aerospace, medical, MINILED, and smart instrumentation.
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      bc620 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      pcba_cleaning_before_after_comparison_actspray

      BC620 PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual

      PCBA Cleaning, Inline
      BC620 is a high-efficiency inline, fully automatic PCBA cleaning machine that can remove water-soluble flux from PCBA. It is used in industries such as automotive electronics, aerospace, medical, MINILED, and smart instrumentation.
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      bc610 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      SMT PCBA Cleaning Machine Manufacturer & Factory | SPERTAR Professional PCB Cleaning Equipment

      BC610 PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual

      PCBA Cleaning, Inline
      The Inline PCBA Cleaning Machine BC610 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin flux, no-clean flux and water-soluble flux residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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      bc630 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      BC630 automatic inline PCBA flux cleaning machine industrial washing equipment for SMT PCB assembly process

      BC630 PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual

      PCBA Cleaning, Inline
      BC630 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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      bc660 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      SPERTAR: Professional SMT PCBA Cleaning Machine Factory & Manufacturer, High-Quality PCB Cleaning Equipment

      BC660 PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual

      PCBA Cleaning, Inline
      The In-line PCBA Cleaning Machine BC660 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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      bc680 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
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      BC680 PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual

      PCBA Cleaning, Inline
      BC680 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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    • Semiconductor
      Hot
      GC860 SIP Inline Zero Wastewater Cleaning Machine | Flux Cleaning System

      GC860 Zero-Wastewater Inline Deflux Cleaning Machine for Advanced Modules and Semiconductor Packages

      Semiconductor, Zero-Wastewater
      The GC860 is a zero-wastewater inline cleaning system designed for post-soldering flux removal from SiP modules, FCBGA packages, optical modules and other precision electronic products.SIP Flux Cleaning | Zero Rinse Wastewater | Closed-Loop Liquid Recovery | Condensation Recovery | Multi-Stage Spray Cleaning | Hot Air Drying | SMEMA | Optional MES
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      FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine
      FC610 BGA Inline Aqueous Cleaning Machine for Solder Ball Mount Flux Removal

      FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine

      Semiconductor, Advanced Packaging
      The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning.It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
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      fc720-inline-cleaner fc720-inline-cleaner Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages
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      FC720 Inline PCBA & Flip Chip Cleaning Machine | Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages

      Semiconductor, Advanced Packaging

      FC720 is a new-generation inline spray cleaning machine independently designed and manufactured by ACTSPRAY for automatic flux residue removal from PCBA assemblies, SiP modules and low-gap flip chip packages.

      The system combines multi-stage chemical spray cleaning, chemical isolation, multi-stage DI water rinsing, air knife and hot air drying in one continuous inline process. Special spray nozzle combinations and adjustable upper/lower spray systems help cleaning liquids penetrate narrow gaps and remove flux residues from densely populated PCBA assemblies and low-standoff semiconductor packages.

      With a 600 mm-wide stainless steel mesh conveyor, adjustable conveyor speed and fully monitored cleaning parameters, FC720 provides a stable and repeatable cleaning process for automated electronics and semiconductor packaging production lines.

      Key Applications: PCBA Cleaning | SiP Cleaning | Flip Chip Cleaning | FCBGA Cleaning | FCCSP Cleaning | Low-Gap Package Cleaning | Flux Residue Removal
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      FC660 Inline Flip Chip semiconductor Cleaner

      FC660 Flip Chip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

      Semiconductor, Advanced Packaging
      FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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      DC260 JEDEC Tray Inline Cleaning Machine | Semiconductor Tray Cleaner

      DC260 JEDEC Tray Inline Cleaning Machine for Semiconductor Tray Cleaning

      Semiconductor, Magazine&Carrier

      JEDEC Tray Cleaning | DI Water Spray Wash | DI Water Rinse | Air Drying| Hot Air Drying | 600 mm Conveyor | SMEMA Integration | Optional MES

      The DC260 provides an automated and repeatable cleaning solution for reusable JEDEC trays, combining DI water spray washing, DI water rinsing, filtered air blow drying and hot air drying in one inline machine.

      Its 600 mm conveyor width accommodates large JEDEC trays, while adjustable conveyor speed and spray pressure allow the cleaning process to be optimized for different production requirements.

      For automated semiconductor manufacturing lines, SMEMA connectivity enables integration with tray loaders, unloaders and conveyors. Optional MES connectivity provides an additional solution for factory-level production monitoring.

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      FC700 Inline FlipChip Semiconductor Cleaner

      FC700 FlipChip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

      Semiconductor, Advanced Packaging
      FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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      FC960 Advanced Packaging Inline Cleaning Machine | FCBGA & FCCSP Cleaner

      FC960 SIP Inline Cleaning Machine for FCBGA FCCSP and 2.5D Advanced Packaging

      Semiconductor, Advanced Packaging
      FC960 Advanced Packaging Inline Cleaning Machine High-Performance Inline Flux Cleaning System for Large-Size, Low-Standoff FCBGA, FCCSP and SIP Packages FCBGA Cleaning | FCCSP Cleaning | SIP Cleaning | 2.5D Packaging | Low-Standoff Flux Removal | 3-Stage Chemical Washing | Multi-Stage DI Rinse | Hot Air Drying | SMEMA | MES / SECS-GEM
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      FC800 Inline Cleaning System for Semiconductor FCBGA, FCCSP & 2.5D3D Packaging Automatic PCB Cleaner
      spertar-advanced semiconductor cleaning solution provider

      FlipChip Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging Automatic PCB Cleaner FC800

      Semiconductor, Advanced Packaging

      The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.

      Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.

      With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.

      The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.

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    • SMT Cleaning
      BC310 Pneumatic SMT Stencil Cleaner for Solder Paste Stencil Cleaning
      BC310 Pneumatic SMT Stencil Cleaner for SMT PCB Assembly Solder Paste Stencil Cleaning

      BC310 Pneumatic SMT Stencil Cleaner | Solder Paste Stencil Cleaning Machine

      SMT Cleaning, Stencil Cleaner
      The BC310 Pneumatic Stencil Cleaner is designed for fast, safe, and efficient cleaning of SMT stencils, removing solder paste and flux residue to ensure consistent printing performance and higher yield.
      ✅ 100% pneumatic operation (no electricity required)
      ✅ 360° high-pressure spray cleaning system
      ✅ Compatible with solvent and water-based cleaning liquids
      ✅ Improve SMT printing quality & reduce defects
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      BC310D Pneumatic Dual-lane Stencil Cleaner SMT

      BC310D Pneumatic Dual-lane Stencil Cleaner SMT Printer Stencil Cleaning Machine

      SMT Cleaning, Stencil Cleaner
      The BC310D is a pneumatic dual-chamber SMT stencil cleaning machine designed for high‑efficiency cleaning of solder paste and red glue stencils. With two independent cleaning systems, 1μm filtration, and fully pneumatic operation, it delivers maximum productivity, safety, and long-term reliability for SMT production lines.
      ✅ Dual independent cleaning systems clean 2 stencils simultaneously
      ✅ 100% pneumatic operation (no electricity required)
      ✅ 360° high-pressure spray cleaning system
      ✅ Compatible with solvent and water-based cleaning liquids
      ✅ Improve SMT printing quality & reduce defects
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      BC320 Stencil Electric Cleaner SMT
      BC320 Electric SMT Stencil Cleaner Automatic Solder Paste Stencil Cleaning Machine-

      BC320 Electric SMT Stencil Cleaner Automatic Solder Paste Stencil Cleaning Machine

      SMT Cleaning, Stencil Cleaner
      The BC320 electric SMT stencil cleaning machine uses a three‑stage process—spray cleaning, DI water rinsing, and hot‑air drying—to clean solder paste stencils, red glue stencils, and misprinted PCBs with high precision. Fully automated, water‑based, and built with SUS304 stainless steel.
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      BC210 coating pallet cleaner
      BC210 Fixture Cleaning Machine for wave soldering fixtures and reflow oven condensers

      Coating Pallet Fixture Cleaning Machine for SMT Production Line Maintenance BC210

      SMT Cleaning, Pallet Cleaner
      BC210 Coating Pallet Cleaning Machine for wave soldering fixtures, reflow oven condensers, claws, chains and PCBA tooling. Water‑based chemcial liquid cleaning, full‑coverage spray, tape water or DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
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      BC220 Reflow Oven Condenser Cleaner SMT

      Reflow Oven Condenser Chiller Cleaning Machine for SMT Production Line Maintenance BC220

      SMT Cleaning, Reflow Condenser Cleaner
      BC210 Pallet Cleaning Machine for wave soldering pallet, reflow oven condensers chiller, claws, chains, filters and PCBA tooling. PLC control, water‑based chemcial liquid cleaning, full‑coverage spray, tape water / DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
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      BC410 SMT Squeegee Auto Cleaning Machine Solder Paste Squeegee Blade Cleaner

      SMT Cleaning, SMT Squeegee Cleaner
      The BC410 Squeegee Cleaning Machine features an integrated ultrasonic and spray cleaning system. It follows a standard three-step workflow: washing with water-based solder paste cleaning fluid, rinsing with DI water, and hot air drying. Each batch can clean 6 to 12 squeegees efficiently. During operation, the squeegees are securely mounted on a special synchronous rotating fixture. This rotating design ensures thorough cleaning of all surfaces, including squeegee gaps, fixture contact areas, and both ends, achieving dead-angle-free cleaning. The result is complete removal of solder paste residues, restoring the squeegees' accuracy for immediate reuse in production.
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      Automatic Solder Feeding Device Cleaning Machine BC420 Customized

      SMT Cleaning, SMT Squeegee Cleaner
      The BC420 is professionally designed to clean automatic solder paste feeding devices. During operation, the automatic solder paste feeding device is fixed onto a rotating bracket inside the cleaning chamber, which keeps rotating throughout the process. Combining the physical force of ultrasonic vibration and high-pressure spraying, together with the chemical dissolving power of water-based solder paste cleaning solution, the BC420 decomposes and removes residual solder paste from surfaces, corners and narrow gaps of the feeding device until thoroughly clean. After cleaning, rinse the unit with DI water or purified tap water, followed by hot air drying to completely eliminate remaining moisture on the device.
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      BC30 SMT Nozzle Cleaning Machine for Pick and Place Nozzle

      SMT Cleaning, SMT Nozzle Cleaner
      BC30 Nozzle Cleaning Machine adopts a multi-nozzle atomized water jet cleaning method to thoroughly remove residual solder paste from nozzles. The equipment features fully automatic cleaning, capable of processing 30 nozzles per cycle. Different nozzle models are matched with corresponding fixture trays, enabling compatibility with nozzles of all placement machine models. After cleaning, the nozzles are automatically dried with compressed air.
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    • Auxiliary Equipment
      All-Kinds-of-Spere-Parts-for-Various-Brands-of-Cleaning-Equipment

      Sealing Strip for KEDTech P/N WGW.02.02.055 Cleaning Machine Spare Part

      Accessories
      We provide all kinds of KEDTech spare part for the cleaning machine See the spare parts list as below. Contact
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      All-Kinds-of-Spere-Parts-for-Various-Brands-of-Cleaning-Equipment

      Female Thread Ball Valve for KEDTech Cleaning Machine Spare Part P/N WGW.01.01.028

      Accessories
      We provide all kinds of KEDTech spare part for the cleaning machine See the spare parts list as below. Contact
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      activated charcoal

      BC200HXT, activated charcoal, 6–12 mesh count, granular activated carbon, spare parts DI water making machine

      Accessories
      BC200HXT, activated charcoal, 6–12 mesh count, granular activated carbon, DI water machine parts
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      All-Kinds-of-Spere-Parts-for-Various-Brands-of-Cleaning-Equipment

      Air Diaphragm Pump Ball for KEDTech Cleaning Machine Spare Part P/N WGD.03.06.050

      Accessories
      We provide all kinds of KEDTech spare part for the cleaning machine See the spare parts list as below. Contact
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      LTV-500 Low Temperature Wastewater Evaporator
      LTV-500 Low Temperature Wastewater Evaporator

      LTV-500 Low Temperature Wastewater Evaporator ACTSPRAY Heat Pump Vacuum Evaporation System

      Auxiliary Equipment, Wastewater Treatment System
      The LTV-500 Low Temperature Wastewater Evaporator is a high-efficiency energy-saving vacuum evaporation wastewater treatment equipment independently developed based on advanced heat pump vacuum evaporation technology. It is widely applied in industrial wastewater concentration and purification scenarios, especially suitable for treating cleaning wastewater containing flux, cleaning agent and oil impurities such as PCBA rinsing water and fixture cleaning wastewater. It can process 500 liters/day of wastewater in 24 hours.
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      AC512MMFT 10-inch 0.45μm Precision Filter Cartridge Industrial Equipment Filtration Filter Element

      AC512MMFT 10-inch 0.45μm Precision Filter Cartridge Industrial Equipment Filtration Filter Element

      Accessories
      Model: AC512MMFT Product Name: Filter Element / Filter Cartridge Specification: 10 inch, 0.45μm microporous filtration Quantity Specification: 2 pieces per set Core Functions: Precision filtration of fine impurities, dust and particulate matter Replacement Cycle: 2–4 weeks
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      All-Kinds-of-Spere-Parts-for-Various-Brands-of-Cleaning-Equipment

      Panel Mount Pressure Gauge for KEDTech Cleaning Machine Spare Part P/N WGW.03.08.151

      Accessories
      We provide all kinds of KEDTech spare part for the cleaning machine See the spare parts list as below. Contact
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      BC310MMFT, door seal strip, 3 meter, fluorine rubber, FKM seal, SMT stencil cleaner parts, pneumatic stencil cleaning machine spare parts, replacement door seal

      BC310MMFT Door Seal Strip 3M Fluorine Rubber Spare Parts for SMT Pneumatic Stencil Cleaning Machine Parts

      Accessories
      • Model: BC310MMFT
      • Product Name: Door Seal Strip
      • Length: 3 meter
      • Material: Fluorine Rubber (FKM)
      • Application: Spare Parts for SMT Pneumatic Stencil Cleaning Machine
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GC860 SIP Inline Zero Wastewater Cleaning Machine | Flux Cleaning System
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fc720-inline-cleaner fc720-inline-cleaner Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages
FC720 Inline PCBA & Flip Chip Cleaning Machine | Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages

GC860 Zero-Wastewater Inline Deflux Cleaning Machine for Advanced Modules and Semiconductor Packages

The GC860 is a zero-wastewater inline cleaning system designed for post-soldering flux removal from SiP modules, FCBGA packages, optical modules and other precision electronic products.

SIP Flux Cleaning | Zero Rinse Wastewater | Closed-Loop Liquid Recovery | Condensation Recovery | Multi-Stage Spray Cleaning | Hot Air Drying | SMEMA | Optional MES

Categories: Semiconductor, Zero-Wastewater Tags: Advanced Packaging Cleaning Machine, Closed-Loop Cleaning Machine, feature product, Inline Semiconductor Cleaning Machine, Inline SIP Cleaner, No Wastewater Cleaning System, Semiconductor Package Cleaning Equipment, Semiconductor Packaging Cleaning Machine, SiP cleaning machine, SIP Flux Cleaning Machine, SIP Flux Removal Machine, SIP Inline Cleaning Machine, SIP Module Cleaning Machine, SIP Package Cleaning Equipment, Water-Based SIP Cleaning Machine, Zero Wastewater Cleaning Machine, Zero Wastewater Flux Cleaning Machine, Zero Wastewater PCBA Cleaning Machine Brand: ACTSPRAY
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Description

GC860 Zero-Wastewater Inline Deflux Cleaning Machine

The GC860 Zero-Wastewater Deflux Inline Cleaning Machine is designed for automatic post-soldering flux removal from SiP modules, FCBGA packages, optical modules, 5G communication modules and automotive electronic modules.

Unlike conventional aqueous cleaning machines that require large quantities of DI water for rinsing and generate rinse wastewater, GC860 uses a closed-loop water-based rinsing process with evaporation and condensation recovery technology. The rinsing liquids are continuously recovered and reused, significantly reducing liquid consumption and eliminating conventional rinse wastewater discharge.

The system integrates pre-washing, multi-stage chemical washing, chemical isolation, multi-stage rinsing, air drying and hot air drying into one continuous automated process.

During washing process, heated water-based cleaning chemistry softens and chemically breaks down flux residues, while high-pressure spray action physically removes the contaminants from component surfaces, solder pads and PCB areas. Multiple rinsing stages then remove remaining residues before air knives drying and hot air drying complete the process.

A dedicated U-shaped condensation recovery system is installed above the rinsing sections. Vapors generated during operation are condensed and recovered, allowing a large portion of the rinsing liquid to be returned to the process.

This design can reduce liquid consumption by approximately 50% compared with conventional condensation methods, depending on operating conditions.

Applications

Advanced Semiconductor Packages

  • FCBGA
  • SiP
  • Power Modules

Optical & Communication Modules

  • Optical Modules
  • 5G Communication Modules
  • High-Speed Communication Modules

Automotive Electronics

  • Domain Controllers
  • Smart Cockpit Modules
  • LiDAR Modules
  • Automotive Communication Modules

Key Applications of actspray gc860 zero-wastewater inline cleaning system

The chemistry should be selected according to the customer’s flux type, component materials and required cleanliness level.

Zero-Rinse-Wastewater Technology

Closed-Loop Rinsing

One of the key advantages of GC860 is its closed-loop rinsing process.

Both the washing liquid and rinsing liquid use the same type of environmentally friendly water-based chemistry.

Instead of continuously consuming fresh DI water and discharging contaminated rinse water, the system uses internal circulation, overflow, evaporation and condensation recovery to reduce liquid consumption.

Process Flow Chart

Pre-Wash → Wash 1 → Wash 2 → Chemical Isolation → Pre-Rinse / Distillation → Rinse 1 → Rinse 2 → Rinse 3 → Air Knife Drying → Hot-Air Drying

The GC860 integrates washing, chemical isolation, distillation, multi-stage rinsing and drying into a continuous inline process.

Key Features

1. Zero-Rinse-Wastewater Process

GC860 is designed around a closed-loop rinsing system that does not require conventional DI water rinsing.

The system recovers contaminated rinse liquid through evaporation and condensation, allowing the recovered liquid to be reused.

This greatly reduces liquid consumption and eliminates conventional rinse wastewater discharge.


2. U-Shaped Condensation Recovery System

Specially designed U-shaped condensers are installed above both the washing and rinsing sections.

Process vapors pass through the condensers, where a large portion of the vapor is condensed and recovered.

The special condensation recovery system can reduce washing liquid consumption by approximately 50% compared with conventional cleaning methods, depending on actual process conditions.


3. Water-Based Environmentally Friendly Chemistry

GC860 uses water-based environmentally friendly washing and rinsing chemistry.

The same type of water-based liquid can be used in both the washing and rinsing process, simplifying liquid management.


4. 3-Stage Spray Washing+4-Stage Spray Rinsing

The washing and rinsing sections use upper and lower spray manifolds.

Spray pressure and spray manifold angles can be adjusted according to the SIP module design and contamination requirements.


5. Variable-Frequency Spray Pressure Control

Washing and rinsing spray pressure can be adjusted through variable-frequency control.

Electronic pressure monitoring provides real-time process monitoring and alarm functions.


6. Adjustable Chemical Isolation Air Knives

The chemical isolation section provides adjustable:

  • Air pressure
  • Air knife angle

This helps reduce washing liquid carryover and improves separation between washing and rinsing stages.


7. Full SUS304 Stainless Steel Machine Frame

The machine frame, pipelines, mesh belt are constructed using 100% SUS304 stainless steel.

The material provides:

  • Corrosion resistance
  • High-temperature resistance
  • High-pressure liquid resistance
  • Mechanical durability
  • Long service life

8. PC + PLC Control

The GC860 uses PC + PLC control with a Windows 10-based bilingual interface.

Operators can monitor and adjust major process parameters through the control system.


9. Real-Time Pressure Monitoring

Electronic pressure monitoring continuously monitors the pressure of the washing , rinsing and air systems.

Abnormal pressure conditions can trigger alarms for process protection.


10. Leakage Detection

Automatic leakage detection is provided for both the washing and rinsing sections.

The system can detect abnormal liquid leakage and generate an alarm.


11. Multi-Level Safety Protection

The GC860 includes:

  • High and low liquid level protection
  • Over-temperature protection
  • Electrical over-current protection
  • Electrical overload protection
  • Phase-loss protection
  • Phase-sequence protection
  • Emergency stop protection
  • Leakage detection

Emergency stop buttons are installed at the machine inlet, outlet and operator control panel.


12. Three-Layer Leak Protection

The washing and rinsing sections use a three-layer protection structure to reduce the risk of liquid leakage and help reduce operating noise.


13. Insulated Heating Sections

The heating sections use double-layer protection with built-in thermal insulation material.

This improves thermal insulation and helps reduce external surface temperature and operating noise.


14. SMEMA Connectivity

Standard SMEMA signal lines allow GC860 to connect with upstream and downstream equipment.

The system can be integrated with:

  • PCB/SIP loading equipment
  • PCB/SIP unloading equipment
  • Transfer conveyors
  • Automated production lines

15. MES Connectivity

Optional MES software allows the machine to communicate with the customer’s manufacturing execution system.

MES integration can support:

  • Machine status monitoring
  • Production management
  • Process traceability
  • Equipment data collection

16. Automatic Product Detection

Sensors at the machine inlet and outlet provide:

  • Product detection
  • Product counting
  • Input/output tracking
  • Timeout detection
  • Blockage alarm
  • Energy-saving standby

17. Energy-Saving Mode

The machine provides an energy-saving mode to reduce power and utility consumption during standby or low-production conditions.


Basic Technical Specifications

ItemSpecification
ModelGC860
BrandACTSPRAY
Maximum Product SizeL400 × W600 × H100 mm
Conveyor Mesh Width600 mm
Conveyor Speed0.1–1.5 m/min
Transfer DirectionLeft to Right
Conveyor Height920 ± 25 mm
Washing Liquid TemperatureRT–80°C
Pre-Rinse Liquid TemperatureRT–60°C
Rinse Liquid TemperatureRT–60°C
Hot Air Drying TemperatureRT–100°C
PCW Supply<15°C
PCW Flow Rate100–120 L/min
PCW Pressure>0.3 MPa
Exhaust Air Volume60 m³/min
Total Power202 kW
Power SupplyAC 380 V, 3 Phase, 50 Hz
Rated Current350 A
Compressed Air Supply0.5–0.7 MPa
Compressed Air Consumption200 L/min
Machine DimensionsApprox. L8600 × W1850 × H1920 mm
Machine WeightApprox. 5200 kg
Control SystemPC + PLC
Operation InterfaceWindows 10, Chinese / English
SMEMA InterfaceStandard
MES ConnectionOptional

RT = Room Temperature. Final machine dimensions are subject to the approved equipment layout. Actual process parameters may be optimized according to SIP design, flux type, chemistry and required cleanliness level.


Why Choose the GC860?

The GC860 combines zero-wastewater liquid management, controlled spray washing, multi-stage rinsing, liquid recovery, inline automation and intelligent monitoring in one system.

It is designed for manufacturers looking to introduce an automated post-soldering washing process while reducing conventional rinse-water discharge and liquid consumption.

ACTSPRAY provides process evaluation, equipment configuration and cleaning solution support according to product structure, contamination type and production requirements.

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    FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine
    FC610 BGA Inline Aqueous Cleaning Machine for Solder Ball Mount Flux Removal

    FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine

    Semiconductor, Advanced Packaging
    The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning.It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
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    FC660 Inline Flip Chip semiconductor Cleaner

    FC660 Flip Chip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

    Semiconductor, Advanced Packaging
    FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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    FC700 Inline FlipChip Semiconductor Cleaner

    FC700 FlipChip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

    Semiconductor, Advanced Packaging
    FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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    FC760 pcba inline cleaning machine

    FC760 Inline Deflux Cleaning Machine for Semiconductor Packaging & PCBA High Volume Production

    Semiconductor, Advanced Packaging

    The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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      BC210 Fixture Cleaning Machine for wave soldering fixtures and reflow oven condensers

      Coating Pallet Fixture Cleaning Machine for SMT Production Line Maintenance BC210

      SMT Cleaning, Pallet Cleaner
      BC210 Coating Pallet Cleaning Machine for wave soldering fixtures, reflow oven condensers, claws, chains and PCBA tooling. Water‑based chemcial liquid cleaning, full‑coverage spray, tape water or DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
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      DC260 JEDEC Tray Inline Cleaning Machine | Semiconductor Tray Cleaner

      DC260 JEDEC Tray Inline Cleaning Machine for Semiconductor Tray Cleaning

      Semiconductor, Magazine&Carrier

      JEDEC Tray Cleaning | DI Water Spray Wash | DI Water Rinse | Air Drying| Hot Air Drying | 600 mm Conveyor | SMEMA Integration | Optional MES

      The DC260 provides an automated and repeatable cleaning solution for reusable JEDEC trays, combining DI water spray washing, DI water rinsing, filtered air blow drying and hot air drying in one inline machine.

      Its 600 mm conveyor width accommodates large JEDEC trays, while adjustable conveyor speed and spray pressure allow the cleaning process to be optimized for different production requirements.

      For automated semiconductor manufacturing lines, SMEMA connectivity enables integration with tray loaders, unloaders and conveyors. Optional MES connectivity provides an additional solution for factory-level production monitoring.

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      fc730 inline cleaning machine advanced packaging cleaning machine for fcBGA SiP and chiplet semiconductor manufacturing
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      FC730 Inline Cleaning Machine for FCBGA Semiconductor Packaging Flux Removal Automatic PCB Cleaner

      Semiconductor, Advanced Packaging

      FC730 is FCBGA or SIP flux auto cleaning system, engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC730 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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      FC960 Advanced Packaging Inline Cleaning Machine | FCBGA & FCCSP Cleaner

      FC960 SIP Inline Cleaning Machine for FCBGA FCCSP and 2.5D Advanced Packaging

      Semiconductor, Advanced Packaging
      FC960 Advanced Packaging Inline Cleaning Machine High-Performance Inline Flux Cleaning System for Large-Size, Low-Standoff FCBGA, FCCSP and SIP Packages FCBGA Cleaning | FCCSP Cleaning | SIP Cleaning | 2.5D Packaging | Low-Standoff Flux Removal | 3-Stage Chemical Washing | Multi-Stage DI Rinse | Hot Air Drying | SMEMA | MES / SECS-GEM
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      FC800 Inline Cleaning System for Semiconductor FCBGA, FCCSP & 2.5D3D Packaging Automatic PCB Cleaner
      spertar-advanced semiconductor cleaning solution provider

      FlipChip Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging Automatic PCB Cleaner FC800

      Semiconductor, Advanced Packaging

      The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.

      Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.

      With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.

      The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.

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      FC760S substrate inline cleaning machine

      IC Substrate Inline Cleaning Machine for Semiconductor Packaging Flux Cleaning Equipment FC760S

      Semiconductor, Advanced Packaging

      The FC760S  is a substrate inline cleaning machine designed for cleaning advanced packaging substrates, it adopting PC+PLC control system and stainless steel mesh conveyor, and dual-side spray washing/rinsing to remove flux residues efficiently. 

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      mc560-leadframe-magazine-cleaning-system-actspray

      MC560 Magazine Inline Ultrasonic Cleaning System | Automatic Lead Frame Magazine Cleaner

      Semiconductor, Magazine&Carrier

      The MC560 Magazine Inline Ultrasonic Cleaning System is specially designed for automatic cleaning of leadframe magazines (carrier magazines) used in semiconductor packaging and electronics manufacturing.

      The system adopts a combination of immersion ultrasonic cleaning, DI water rinsing, and hot air drying technology to effectively remove contaminants such as dust, particles, oil residues, and process residues from magazine surfaces.

      With a fully automated loading and unloading design, the MC560 helps manufacturers improve cleaning consistency, reduce manual handling, and maintain high cleanliness standards for advanced semiconductor packaging processes.

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      FC820 SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner
      Advanced packaging cleaning machine for fcBGA SiP and chiplet semiconductor manufacturing

      SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner FC820

      Semiconductor, Advanced Packaging
      FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs. As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures. Typical cleaning challenges include: - Flux trapped under ultra-low standoff gap; - Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages; - Ionic contamination affecting reliability; - Cleaning consistency in high-volume inline production.The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.
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        ACTSPRAY logo 1096x141 T W

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        • No.74, Zhen'an East Road, Dongguan city, Guangdong, 523000, China
        • Phone: +86 189 3805 4154
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        • OEM, ODM, EMS and PCBA Understanding the Four Key Concepts in Electronics Manufacturing
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