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FC960 Advanced Packaging Inline Cleaning Machine | FCBGA & FCCSP Cleaner

FC960 SIP Inline Cleaning Machine for FCBGA FCCSP and 2.5D Advanced Packaging

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FC960 Advanced Packaging Inline Cleaning Machine High-Performance Inline Flux Cleaning System for Large-Size, Low-Standoff FCBGA, FCCSP and SIP Packages FCBGA Cleaning | FCCSP Cleaning | SIP Cleaning | 2.5D Packaging | Low-Standoff Flux Removal | 3-Stage Chemical Washing | Multi-Stage DI Rinse | Hot Air Drying | SMEMA | MES / SECS-GEM
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GC860 SIP Inline Zero Wastewater Cleaning Machine | Flux Cleaning System

GC860 Zero-Wastewater Inline Deflux Cleaning Machine for Advanced Modules and Semiconductor Packages

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The GC860 is a zero-wastewater inline cleaning system designed for post-soldering flux removal from SiP modules, FCBGA packages, optical modules and other precision electronic products.SIP Flux Cleaning | Zero Rinse Wastewater | Closed-Loop Liquid Recovery | Condensation Recovery | Multi-Stage Spray Cleaning | Hot Air Drying | SMEMA | Optional MES
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