AC100 Ion Contamination Tester for PCBs and Electronic Components Cleanliness Tester
AC100 is an ionic contamination tester for PCBA, PCB and semiconductor parts.
According to the method of ionic contamination degree test defined in IPC-TM-650, the test process includes 3 processes: solvent regeneration, ion contamination solvent extraction and ion contamination degree measurement.
This tester adopts a high-purity, high-capacity ion exchange device. Before each test, the solvent is regenerated through the ion exchange device according to the setting value to ensure that the ion content in the solvent meets the test requirements before each test.
AC160 Ion Contamination Tester for PCBs and Electronic Components Cleanliness Tester
AC106 According to the method of ionic contamination degree test defined in IPC-TM-650, the test process includes 3 processes: solvent regeneration, ion contamination solvent extraction and ion contamination degree measurement.
This tester adopts a high-purity, high-capacity ion exchange device. Before each test, the solvent is regenerated through the ion exchange device according to the setting value to ensure that the ion content in the solvent meets the test requirements before each test.
AC460 PCB Surface Cleaning Machine ACTSPRAY Inline Bare PCB Dust & Static Removal System
AC460 bare PCB surface cleaning machine is designed to remove dust, particles, copper scraps and static electricity from bare PCBs before solder paste printing or adhesive coating. Featuring vacuum cleaning, tacky roller dedusting and ionized static elimination, AC460 helps improve print quality, reduce soldering defects and enhance PCB manufacturing reliability.
Automatic Solder Feeding Device Cleaning Machine BC420 Customized
The BC420 is professionally designed to clean automatic solder paste feeding devices.
During operation, the automatic solder paste feeding device is fixed onto a rotating bracket inside the cleaning chamber, which keeps rotating throughout the process.
Combining the physical force of ultrasonic vibration and high-pressure spraying, together with the chemical dissolving power of water-based solder paste cleaning solution, the BC420 decomposes and removes residual solder paste from surfaces, corners and narrow gaps of the feeding device until thoroughly clean.
After cleaning, rinse the unit with DI water or purified tap water, followed by hot air drying to completely eliminate remaining moisture on the device.
Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal AC510
The AC510 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal AC530
The AC530 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
BC30 SMT Nozzle Cleaning Machine for Pick and Place Nozzle
BC30 Nozzle Cleaning Machine adopts a multi-nozzle atomized water jet cleaning method to thoroughly remove residual solder paste from nozzles. The equipment features fully automatic cleaning, capable of processing 30 nozzles per cycle. Different nozzle models are matched with corresponding fixture trays, enabling compatibility with nozzles of all placement machine models. After cleaning, the nozzles are automatically dried with compressed air.
BC700 Inline PCBA Cleaning Machine for Automatic Flux Removal
BC710 Inline PCBA Cleaning Machine | Automatic PCB Flux Cleaner
The BC710 combines high-pressure spray cleaning, multi-stage DI water rinsing, controlled drying and intelligent process monitoring in a single inline platform.
Its large 600 mm transport width makes it suitable for large PCBA assemblies, while adjustable spray pressure, temperature, chemical concentration and DI water quality monitoring provide the process flexibility required for demanding electronics manufacturing.
For factories requiring automated production and traceability, the optional MES connection allows BC710 to become part of an intelligent PCBA manufacturing line.600 mm Transport Width | Multi-Stage Spray Cleaning | DI Water Rinsing | Hot Air Drying | BGA & uBGA Cleaning | MES Integration | PC + PLC Control
BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine FC610
The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning.It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
Coating Pallet Fixture Cleaning Machine for SMT Production Line Maintenance BC210
BC210 Coating Pallet Cleaning Machine for wave soldering fixtures, reflow oven condensers, claws, chains and PCBA tooling. Water‑based chemcial liquid cleaning, full‑coverage spray, tape water or DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
DC260 JEDEC Tray Inline Cleaning Machine for Semiconductor Tray Cleaning
JEDEC Tray Cleaning | DI Water Spray Wash | DI Water Rinse | Air Drying| Hot Air Drying | 600 mm Conveyor | SMEMA Integration | Optional MES
The DC260 provides an automated and repeatable cleaning solution for reusable JEDEC trays, combining DI water spray washing, DI water rinsing, filtered air blow drying and hot air drying in one inline machine.
Its 600 mm conveyor width accommodates large JEDEC trays, while adjustable conveyor speed and spray pressure allow the cleaning process to be optimized for different production requirements.
For automated semiconductor manufacturing lines, SMEMA connectivity enables integration with tray loaders, unloaders and conveyors. Optional MES connectivity provides an additional solution for factory-level production monitoring.
