FC800-C PLP Inline Cleaning Machine for Flux Residue Removal
FC960 SIP Inline Cleaning Machine for FCBGA FCCSP and 2.5D Advanced Packaging
FlipChip Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging Automatic PCB Cleaner FC800
The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.
Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.
With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.
The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.
GC860 Zero-Wastewater Inline Deflux Cleaning Machine for Advanced Modules and Semiconductor Packages
IC Substrate Inline Cleaning Machine for Semiconductor Packaging Flux Cleaning Equipment FC760S
IC600 Ion Contamination Tester for PCB & PCBA Cleanliness Testing
The IC600 Ion Contamination Tester is used to measure ionic contamination on the surface of PCBs, PCBAs and semiconductor components.
The tester uses a circulating extraction method to remove ionic residues from the product surface and transfer them into the test solution. The solution is then measured by a high-precision resistivity measurement system. Based on the measurement results, the IC600 calculates the average ionic contamination level per unit area.
The test results can be used for PCB cleanliness inspection, cleaning process evaluation, production quality control and outgoing inspection.
LTV-500 Low Temperature Wastewater Evaporator Heat Pump Vacuum Evaporation System
MC560 Magazine Inline Ultrasonic Cleaning System | Automatic Lead Frame Magazine Cleaner
The MC560 Magazine Inline Ultrasonic Cleaning System is specially designed for automatic cleaning of leadframe magazines (carrier magazines) used in semiconductor packaging and electronics manufacturing.
The system adopts a combination of immersion ultrasonic cleaning, DI water rinsing, and hot air drying technology to effectively remove contaminants such as dust, particles, oil residues, and process residues from magazine surfaces.
With a fully automated loading and unloading design, the MC560 helps manufacturers improve cleaning consistency, reduce manual handling, and maintain high cleanliness standards for advanced semiconductor packaging processes.
PCBA Batch Cleaning Machine for Circuit Board Assembly SIP Electronic Cleaning Equipment AC630
AC630 is a high-performance Batch PCBA Cleaning Machine features vertical spray cleaning. The spray bars and air knives are fixed, while PCBA travels back and forth with fixtures (the most stable structure in pcb cleaning field), it can effectively remove flux from PCBs with fine-pitch and flip-chip components. AC620 fitted with dual tracks and two complete cleaning zones on both sides. Each zone is equipped with 4 high-pressure spray bars and 4 professional drying air knives. Two rows of SIP/PCBA can be processed at the same time, doubling the production capacity.
Reflow Oven Condenser Chiller Cleaning Machine for SMT Production Line Maintenance BC220
SC720 IGBT Inline Ultrasonic Cleaning Machine | Lead Frame Flux Cleaning Equipment
The SC720 IGBT Inline Ultrasonic Cleaning Machine is specially designed for automated cleaning of IGBT modules, IPM (Intelligent Power Modules), and leadframe-based semiconductor packages.
Using a combination of multi-stage ultrasonic cleaning, spray cleaning, and DI water rinsing technology, the system effectively removes flux residues, organic contaminants, and process residues generated during semiconductor packaging processes.
With a fully automated loading and unloading system, SC720 provides a reliable cleaning solution for high-volume semiconductor manufacturing, improving product cleanliness, reliability, and production efficiency.
