PCBA Cleaning Machine Manufacturer | Inline & Batch Flux Cleaning Equipment.
PCBA Cleaning Machine Manufacturer | Inline & Batch Flux Cleaning Equipment.
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    • PCBA Cleaning Machine
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      Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal AC530

      PCBA Cleaning Machine, Batch PCBA Cleaner
      The AC530 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
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      AC510 PCBA cleaning machine, automatic PCBA flux cleaner, batch type PCB cleaning equipment, industrial electronic assembly cleaner, SMT/THT PCBA cleaning machine
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      Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal AC510

      PCBA Cleaning Machine, Batch PCBA Cleaner
      The AC510 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
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      PCBA Inline DI Water Washing Cleaning System for Removing Water-Soluble Flux BC560
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      PCBA Inline DI Water Washing Cleaning System for Removing Water-Soluble Flux BC560

      PCBA Cleaning Machine, Inline PCBA Cleaner
      BC560 is a fully automatic inline DI water cleaning machine for PCBA. It is suitable for large batches cleaning of water-soluble flux residues on PCBA and widely used in industries including automotive electronics, aerospace, medical, MINILED, and smart instrumentation.
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      bc620 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
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      PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual BC620

      PCBA Cleaning Machine, Inline PCBA Cleaner
      BC620 is a high-efficiency inline, fully automatic PCBA cleaning machine that can remove water-soluble flux from PCBA. It is used in industries such as automotive electronics, aerospace, medical, MINILED, and smart instrumentation.
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      bc610 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      SMT PCBA Cleaning Machine Manufacturer & Factory | SPERTAR Professional PCB Cleaning Equipment

      PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual BC610

      PCBA Cleaning Machine, Inline PCBA Cleaner
      The Inline PCBA Cleaning Machine BC610 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin flux, no-clean flux and water-soluble flux residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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      bc630 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      BC630 automatic inline PCBA flux cleaning machine industrial washing equipment for SMT PCB assembly process

      PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual BC630

      PCBA Cleaning Machine, Inline PCBA Cleaner
      BC630 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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      bc660 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      SPERTAR: Professional SMT PCBA Cleaning Machine Factory & Manufacturer, High-Quality PCB Cleaning Equipment

      PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual BC660

      PCBA Cleaning Machine, Inline PCBA Cleaner
      The In-line PCBA Cleaning Machine BC660 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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      bc680 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
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      PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual BC680

      PCBA Cleaning Machine, Inline PCBA Cleaner
      BC680 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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    • Semiconductor Cleaning Equipment
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      GC860 SIP Inline Zero Wastewater Cleaning Machine | Flux Cleaning System

      GC860 SIP Inline Zero Wastewater Cleaning Machine for Flux Cleaning

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      FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine
      FC610 BGA Inline Aqueous Cleaning Machine for Solder Ball Mount Flux Removal

      BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine FC610

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner
      The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning.It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
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      fc720-inline-cleaner fc720-inline-cleaner Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages
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      FC720 Inline PCBA & Flip Chip Cleaning Machine | Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

      FC720 is a new-generation inline spray cleaning machine independently designed and manufactured by ACTSPRAY for automatic flux residue removal from PCBA assemblies, SiP modules and low-gap flip chip packages.

      The system combines multi-stage chemical spray cleaning, chemical isolation, multi-stage DI water rinsing, air knife and hot air drying in one continuous inline process. Special spray nozzle combinations and adjustable upper/lower spray systems help cleaning liquids penetrate narrow gaps and remove flux residues from densely populated PCBA assemblies and low-standoff semiconductor packages.

      With a 600 mm-wide stainless steel mesh conveyor, adjustable conveyor speed and fully monitored cleaning parameters, FC720 provides a stable and repeatable cleaning process for automated electronics and semiconductor packaging production lines.

      Key Applications: PCBA Cleaning | SiP Cleaning | Flip Chip Cleaning | FCBGA Cleaning | FCCSP Cleaning | Low-Gap Package Cleaning | Flux Residue Removal
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      FC660 Inline Flip Chip semiconductor Cleaner

      FC660 Flip Chip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner
      FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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      DC260 JEDEC Tray Inline Cleaning Machine | Semiconductor Tray Cleaner

      DC260 JEDEC Tray Inline Cleaning Machine for Semiconductor Tray Cleaning

      Semiconductor Cleaning Equipment, Magazine&Carrier Cleaner

      JEDEC Tray Cleaning | DI Water Spray Wash | DI Water Rinse | Air Drying| Hot Air Drying | 600 mm Conveyor | SMEMA Integration | Optional MES

      The DC260 provides an automated and repeatable cleaning solution for reusable JEDEC trays, combining DI water spray washing, DI water rinsing, filtered air blow drying and hot air drying in one inline machine.

      Its 600 mm conveyor width accommodates large JEDEC trays, while adjustable conveyor speed and spray pressure allow the cleaning process to be optimized for different production requirements.

      For automated semiconductor manufacturing lines, SMEMA connectivity enables integration with tray loaders, unloaders and conveyors. Optional MES connectivity provides an additional solution for factory-level production monitoring.

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      FC700 Inline FlipChip Semiconductor Cleaner

      FC700 FlipChip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner
      FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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      FC960 Advanced Packaging Inline Cleaning Machine | FCBGA & FCCSP Cleaner

      FC960 SIP Inline Cleaning Machine for FCBGA FCCSP and 2.5D Advanced Packaging

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner
      FC960 Advanced Packaging Inline Cleaning Machine High-Performance Inline Flux Cleaning System for Large-Size, Low-Standoff FCBGA, FCCSP and SIP Packages FCBGA Cleaning | FCCSP Cleaning | SIP Cleaning | 2.5D Packaging | Low-Standoff Flux Removal | 3-Stage Chemical Washing | Multi-Stage DI Rinse | Hot Air Drying | SMEMA | MES / SECS-GEM
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      FC800 Inline Cleaning System for Semiconductor FCBGA, FCCSP & 2.5D3D Packaging Automatic PCB Cleaner
      spertar-advanced semiconductor cleaning solution provider

      FlipChip Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging Automatic PCB Cleaner FC800

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

      The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.

      Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.

      With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.

      The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.

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    • SMT Cleaning Equipment
      BC310 Pneumatic SMT Stencil Cleaner for Solder Paste Stencil Cleaning
      BC310 Pneumatic SMT Stencil Cleaner for SMT PCB Assembly Solder Paste Stencil Cleaning

      Pneumatic SMT Stencil Cleaner | Solder Paste Stencil Cleaning Machine BC310

      SMT Cleaning Equipment, SMT Stencil Cleaner
      The BC310 Pneumatic Stencil Cleaner is designed for fast, safe, and efficient cleaning of SMT stencils, removing solder paste and flux residue to ensure consistent printing performance and higher yield.
      ✅ 100% pneumatic operation (no electricity required)
      ✅ 360° high-pressure spray cleaning system
      ✅ Compatible with solvent and water-based cleaning liquids
      ✅ Improve SMT printing quality & reduce defects
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      Pneumatic Dual-lane Stencil Cleaner SMT Printer Stencil Cleaning Machine BC310D

      SMT Cleaning Equipment, SMT Stencil Cleaner
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      ✅ Dual independent cleaning systems clean 2 stencils simultaneously
      ✅ 100% pneumatic operation (no electricity required)
      ✅ 360° high-pressure spray cleaning system
      ✅ Compatible with solvent and water-based cleaning liquids
      ✅ Improve SMT printing quality & reduce defects
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      BC320 Stencil Electric Cleaner SMT

      Electric SMT Stencil Cleaner Automatic Solder Paste Stencil Cleaning Machine BC320

      SMT Cleaning Equipment, SMT Stencil Cleaner
      The BC320 electric SMT stencil cleaning machine uses a three‑stage process—spray cleaning, DI water rinsing, and hot‑air drying—to clean solder paste stencils, red glue stencils, and misprinted PCBs with high precision. Fully automated, water‑based, and built with SUS304 stainless steel.
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      BC210 Fixture Cleaning Machine for wave soldering fixtures and reflow oven condensers

      Coating Pallet Fixture Cleaning Machine for SMT Production Line Maintenance BC210

      SMT Cleaning Equipment, SMT Pallet Cleaner
      BC210 Coating Pallet Cleaning Machine for wave soldering fixtures, reflow oven condensers, claws, chains and PCBA tooling. Water‑based chemcial liquid cleaning, full‑coverage spray, tape water or DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
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      Reflow Oven Condenser Chiller Cleaning Machine for SMT Production Line Maintenance BC220

      SMT Cleaning Equipment, Reflow Condenser Cleaner
      BC210 Pallet Cleaning Machine for wave soldering pallet, reflow oven condensers chiller, claws, chains, filters and PCBA tooling. PLC control, water‑based chemcial liquid cleaning, full‑coverage spray, tape water / DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
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      SMT Cleaning Equipment, SMT Squeegee Cleaner
      The BC410 Squeegee Cleaning Machine features an integrated ultrasonic and spray cleaning system. It follows a standard three-step workflow: washing with water-based solder paste cleaning fluid, rinsing with DI water, and hot air drying. Each batch can clean 6 to 12 squeegees efficiently. During operation, the squeegees are securely mounted on a special synchronous rotating fixture. This rotating design ensures thorough cleaning of all surfaces, including squeegee gaps, fixture contact areas, and both ends, achieving dead-angle-free cleaning. The result is complete removal of solder paste residues, restoring the squeegees' accuracy for immediate reuse in production.
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      Automatic Solder Feeding Device Cleaning Machine BC420 Customized

      SMT Cleaning Equipment, SMT Squeegee Cleaner
      The BC420 is professionally designed to clean automatic solder paste feeding devices. During operation, the automatic solder paste feeding device is fixed onto a rotating bracket inside the cleaning chamber, which keeps rotating throughout the process. Combining the physical force of ultrasonic vibration and high-pressure spraying, together with the chemical dissolving power of water-based solder paste cleaning solution, the BC420 decomposes and removes residual solder paste from surfaces, corners and narrow gaps of the feeding device until thoroughly clean. After cleaning, rinse the unit with DI water or purified tap water, followed by hot air drying to completely eliminate remaining moisture on the device.
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      BC30 SMT Nozzle Cleaning Machine for Pick and Place Nozzle

      SMT Cleaning Equipment, SMT Nozzle Cleaner
      BC30 Nozzle Cleaning Machine adopts a multi-nozzle atomized water jet cleaning method to thoroughly remove residual solder paste from nozzles. The equipment features fully automatic cleaning, capable of processing 30 nozzles per cycle. Different nozzle models are matched with corresponding fixture trays, enabling compatibility with nozzles of all placement machine models. After cleaning, the nozzles are automatically dried with compressed air.
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FC800-C PLP Inline Cleaning System PLP Panel Flux Cleaning Machine
FC800-C PLP inline cleaning system for automated flux residue removal from PLP panels and SIP modules. Multi-stage spray cleaning, DI water rinsing and hot-air drying.
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FC800-C PLP Inline Cleaning System PLP Panel Flux Cleaning Machine
FC800-C PLP inline cleaning system for automated flux residue removal from PLP panels and SIP modules. Multi-stage spray cleaning, DI water rinsing and hot-air drying.
Home Semiconductor Cleaning Equipment Advanced Packaging Cleaner FC800-C PLP Inline Cleaning Machine for Flux Residue Removal
IC600 Ion Contamination Tester for PCB, PCBA & Semiconductor Components
IC600 Ion Contamination Tester for PCB & PCBA Cleanliness Testing
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FC580 automatic carrier inline spray cleaning system for removing dust, particles and water-soluble flux residues from semiconductor carriers. DI water rinsing and hot-air drying.
FC580 Carrier Inline Spray Cleaning Machine for Semiconductor Carriers

FC800-C PLP Inline Cleaning Machine for Flux Residue Removal

PLP Cleaning Machine | Panel Level Packaging Cleaning Machine | Semiconductor Packaging Cleaning Machine | Flux Residue Removal Machine

Categories: Advanced Packaging Cleaner, Semiconductor Cleaning Equipment Tags: automated PLP cleaning equipment, flux cleaning machine, flux residue removal, inline spray cleaning machine, inline spray cleaning system, panel level packaging cleaning machine, panel packaging cleaning system, PLP cleaning machine, PLP inline cleaning system, PLP panel cleaning machine, semiconductor flux cleaning, Semiconductor Packaging Cleaning Machine, SIP Module Cleaning Machine Brand: ACTSPRAY
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  • Description
Description

Product Overview

The FC800-C PLP Inline Cleaning Machineis an automated spray cleaning machine developed for removing flux residues from PLP (Panel-Level Packaging) panels and SIP modules.

Designed for inline production environments, the machine uses a stainless steel mesh conveyor and multi-stage top-and-bottom spray cleaning. Adjustable spray pressure and spray bar angles provide effective cleaning coverage, including the bottom gaps and recessed areas of SIP modules where flux residues can be difficult to remove.

The cleaning process combines dedicated washing sections, chemical isolation, multiple DI water rinsing stages, air drying, and hot-air drying. This allows the FC800-C to provide a consistent and controlled cleaning process while reducing manual handling and improving production efficiency.

The machine is controlled by PC + PLC, with an intuitive bilingual operating interface. SMEMA communication is provided for integration with upstream and downstream equipment, while optional MES or SECS/GEM connectivity enables production monitoring and equipment data management.

Key Features

  • Designed for PLP and SIP cleaning
    Developed specifically for removing flux residues from PLP panels and SIP modules, including residues located in bottom gaps and recessed areas.
  • Multi-stage spray washing process
    Long washing sections with adjustable spray pressure and spray bar angles provide thorough and consistent cleaning coverage.
  • Top-and-bottom spray configuration
    Washing liquid and DI water are sprayed from both the upper and lower sides to improve cleaning performance on complex panel structures.
  • Dedicated PLP spray nozzles
    Specially configured nozzle assemblies provide effective washing and rinsing coverage for PLP panels.
  • Chemical isolation section
    Separates the cleaning solution from the subsequent rinsing stages to reduce chemical carryover and minimize DI water consumption.
  • Long rinsing section
    Multiple rinsing stages provide progressive removal of cleaning solution and contaminants from the panel surface.
  • Adjustable air drying
    Air pressure and air drying angle can be adjusted according to the product and process requirements to improve liquid separation before drying.
  • Two-stage hot-air drying
    Dual hot-air drying sections provide effective moisture removal before panels exit the machine.
  • Automatic washing liquid management
    Cleaning solution can be automatically added and discharged according to the configured process requirements.
  • Dual condensation recovery system
    The washing section is equipped with a dual condensation recovery system to reduce washing liquid loss and operating consumption.
  • Washing liquid cooling system
    Helps maintain the cleaning solution within the required operating temperature range during continuous production.
  • DI water resistivity monitoring
    Real-time monitoring of DI water resistivity helps maintain consistent rinsing conditions.
  • Automatic leak detection
    Leakage detection is provided for both washing liquid and water systems to improve equipment safety.
  • SMEMA communication
    Standard SMEMA signal connection allows communication with upstream and downstream production equipment.
  • Automatic panel tracking and energy-saving standby
    Sensors at the machine inlet and outlet provide panel tracking, timeout detection, panel memory and standby energy-saving functions.
  • Comprehensive safety protection
    Electrical overcurrent and overload protection, tank high/low level protection and heating over-temperature protection are integrated into the system.
  • Optional washing concentration control
    An optional real-time cleaning solution concentration monitoring and compensation system can automatically help maintain the required chemical concentration.
  • Optional MES / SECS-GEM integration
    The machine can be connected to MES or SECS/GEM systems for production monitoring, equipment status management and data collection.

Cleaning Process

Loading → Pre-washing→ Washing 1 → Washing 2 → Chemical Isolation → Pre-rinsing → Rinsing 1 → Rinsing 2 → Final Rinsing → Air Drying→ Hot-Air Drying 1 → Hot-Air Drying 2 → Unloading

The multi-stage process is designed to progressively remove flux residues, separate cleaning chemicals, rinse remaining contaminants and dry the panels before they return to the production line.

Construction & Control

The FC800-C is constructed primarily from SUS304 stainless steel, providing good resistance to corrosion from cleaning chemicals and water. The machine is designed for long-term industrial operation.

The PC + PLC control system provides centralized control of washing, rinsing, drying, temperature, liquid levels, conveyor operation and safety functions. The bilingual operating interface simplifies setup and daily operation.

Automation & Production Integration

The FC800-C is designed for integration into automated PLP packaging production lines.

Its SMEMA interface allows the cleaning system to communicate with connected equipment. Inlet and outlet sensors monitor panel movement and provide panel tracking and timeout detection.

For advanced production environments, optional MES and SECS/GEM connectivity can be configured to support equipment monitoring and production data management.

Applications

The FC800-C is suitable for applications including:

  • PLP panel cleaning
  • Panel-level packaging
  • SIP module cleaning
  • Semiconductor packaging
  • Advanced packaging processes
  • Flux residue removal
  • Post-reflow cleaning
  • Automated inline PCBA and package cleaning

Parameters

ParameterFC800-C
Equipment TypePLP Inline Cleaning Machine
ModelFC800-C
ApplicationPLP Panel / SIP Module Cleaning
Cleaning MethodTop & Bottom Spray Cleaning
Rinsing MethodMulti-stage DI Water Spray Rinsing
Drying MethodAir Drying + 2-Stage Hot-Air Drying
ConveyorStainless Steel Mesh Conveyor
Control SystemPC + PLC
Operating InterfaceBilingual
Main ConstructionSUS304 Stainless Steel
Washing SectionsPre-washing + 2 Washing Stages
Rinsing SectionsPre-rinsing + 3 Rinsing Stages
Chemical IsolationStandard
Air DryingAdjustable Pressure & Angle
Washing Liquid ManagementAutomatic Add & Discharge
Washing Liquid RecoveryDual Condensation Recovery
Washing Liquid CoolingStandard
DI Water MonitoringResistivity Monitoring
Leak DetectionAutomatic
Production CommunicationSMEMA
Panel TrackingInlet & Outlet Sensors
Standby FunctionEnergy-Saving Standby
Safety ProtectionOvercurrent / Overload / High-Low Level / Over-temperature
Washing Concentration ControlOptional
MES ConnectivityOptional
SECS/GEM ConnectivityOptional

Why FC800-C

For PLP and SIP packaging processes, flux residues can remain in narrow gaps and difficult-to-reach areas after soldering or reflow. Manual cleaning or conventional single-sided spraying may not provide consistent coverage.

The FC800-C addresses these requirements with top-and-bottom spray cleaning, adjustable spray parameters, dedicated PLP nozzle configurations, extended washing and rinsing sections, chemical isolation, and controlled drying.

The result is a repeatable inline cleaning process that can be integrated directly into an automated production line.

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    FC730 Inline Cleaning Machine for FCBGA Semiconductor Packaging Flux Removal Automatic PCB Cleaner

    Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

    FC730 is FCBGA or SIP flux auto cleaning system, engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC730 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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    FC760 pcba inline cleaning machine
    spertar-advanced semiconductor cleaning solution provider

    FC760 Inline PCBA Cleaning Machine for Flux Residue Removal in High Volume SMT Production

    Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

    The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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    FC960 Advanced Packaging Inline Cleaning Machine | FCBGA & FCCSP Cleaner

    FC960 SIP Inline Cleaning Machine for FCBGA FCCSP and 2.5D Advanced Packaging

    Semiconductor Cleaning Equipment, Advanced Packaging Cleaner
    FC960 Advanced Packaging Inline Cleaning Machine High-Performance Inline Flux Cleaning System for Large-Size, Low-Standoff FCBGA, FCCSP and SIP Packages FCBGA Cleaning | FCCSP Cleaning | SIP Cleaning | 2.5D Packaging | Low-Standoff Flux Removal | 3-Stage Chemical Washing | Multi-Stage DI Rinse | Hot Air Drying | SMEMA | MES / SECS-GEM
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    FC800 Inline Cleaning System for Semiconductor FCBGA, FCCSP & 2.5D3D Packaging Automatic PCB Cleaner
    spertar-advanced semiconductor cleaning solution provider

    FlipChip Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging Automatic PCB Cleaner FC800

    Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

    The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.

    Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.

    With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.

    The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.

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    GC860 SIP Inline Zero Wastewater Cleaning Machine | Flux Cleaning System

    GC860 SIP Inline Zero Wastewater Cleaning Machine for Flux Cleaning

    Semiconductor Cleaning Equipment, Wastewater-Free Cleaning System
    SIP Flux Cleaning | Zero Rinse Wastewater | Closed-Loop Liquid Recovery | Condensation Recovery | Multi-Stage Spray Cleaning | Hot Air Drying | SMEMA | Optional MES
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    FC820 SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner
    Advanced packaging cleaning machine for fcBGA SiP and chiplet semiconductor manufacturing

    SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner FC820

    Semiconductor Cleaning Equipment, Advanced Packaging Cleaner
    FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs. As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures. Typical cleaning challenges include: - Flux trapped under ultra-low standoff gap; - Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages; - Ionic contamination affecting reliability; - Cleaning consistency in high-volume inline production.The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.
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      ACTSPRAY logo 1096x141 T W

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