Advanced semiconductor manufacturing requires extremely precise cleaning processes to remove flux residues, organic contaminants, particles, and process residues from complex package structures.
As semiconductor packages continue to evolve toward higher integration, finer pitches, smaller gaps, and advanced architectures such as Flip Chip, BGA, SiP, FCBGA, and 2.5D/3D packaging, traditional cleaning methods often struggle to achieve the required cleanliness and reliability.
ACTSPRAY provides multiple cleaning equipment designed for advanced packaging and power semiconductor manufacturing, helping manufacturers improve product reliability, reduce contamination risks, and achieve stable production performance.
From flux residue removal under low standoff components to precision cleaning of semiconductor carriers and production tooling, ACTSPRAY delivers reliable cleaning solutions for demanding semiconductor applications.
ADVANCED PACKAGING
Precision cleaning solutions for Flip Chip, BGA, SiP, FCBGA, and advanced semiconductor packages to remove flux residues from fine-pitch structures and low-gap areas.
POWER MODULE
Dedicated cleaning solutions for IGBT, IPM, leadframe, and power semiconductor devices to improve reliability and prevent contamination-related failures.
ZERO-WASTEWATER
Fully automatic cleaning with zero emission water-free process and recycles cleaning agents to cut costs.
MAGAZINE & CARRIER
Automated cleaning systems for semiconductor magazines, carriers, trays, and handling components to maintain contamination control in production.
Need Help On Your Cleaning Process?
Every manufacturing process has unique contamination challenges. ACTSPRAY provide professional cleaning solutions based on your product requirements, cleanliness standards, and production conditions.
