PCBA Cleaning Machine Manufacturer | Inline & Batch Flux Cleaning Equipment.
PCBA Cleaning Machine Manufacturer | Inline & Batch Flux Cleaning Equipment.
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    • PCBA Cleaning Machine
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      Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal AC530

      PCBA Cleaning Machine, Batch PCBA Cleaner
      The AC530 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
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      AC510 PCBA cleaning machine, automatic PCBA flux cleaner, batch type PCB cleaning equipment, industrial electronic assembly cleaner, SMT/THT PCBA cleaning machine
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      Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal AC510

      PCBA Cleaning Machine, Batch PCBA Cleaner
      The AC510 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
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      PCBA Inline DI Water Washing Cleaning System for Removing Water-Soluble Flux BC560
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      PCBA Inline DI Water Washing Cleaning System for Removing Water-Soluble Flux BC560

      PCBA Cleaning Machine, Inline PCBA Cleaner
      BC560 is a fully automatic inline DI water cleaning machine for PCBA. It is suitable for large batches cleaning of water-soluble flux residues on PCBA and widely used in industries including automotive electronics, aerospace, medical, MINILED, and smart instrumentation.
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      bc620 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      pcba_cleaning_before_after_comparison_actspray

      PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual BC620

      PCBA Cleaning Machine, Inline PCBA Cleaner
      BC620 is a high-efficiency inline, fully automatic PCBA cleaning machine that can remove water-soluble flux from PCBA. It is used in industries such as automotive electronics, aerospace, medical, MINILED, and smart instrumentation.
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      bc610 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      SMT PCBA Cleaning Machine Manufacturer & Factory | SPERTAR Professional PCB Cleaning Equipment

      PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual BC610

      PCBA Cleaning Machine, Inline PCBA Cleaner
      The Inline PCBA Cleaning Machine BC610 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin flux, no-clean flux and water-soluble flux residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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      bc630 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      BC630 automatic inline PCBA flux cleaning machine industrial washing equipment for SMT PCB assembly process

      PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual BC630

      PCBA Cleaning Machine, Inline PCBA Cleaner
      BC630 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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      bc660 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
      SPERTAR: Professional SMT PCBA Cleaning Machine Factory & Manufacturer, High-Quality PCB Cleaning Equipment

      PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual BC660

      PCBA Cleaning Machine, Inline PCBA Cleaner
      The In-line PCBA Cleaning Machine BC660 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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      bc680 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue
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      PCBA Inline Cleaner Automatic SMT Cleaning Machine for Removing Flux Residual BC680

      PCBA Cleaning Machine, Inline PCBA Cleaner
      BC680 is ideal for large batches PCBA cleaning. It adopts inline cleaning system with a sectional upper and lower spray cleaning method, through the process of chemical fluid cleaning + DI water rinsing + hot air drying, can completely removes rosin, flux residue and solder paste residues on SMT or THT PCBA after welding. It's used in industries such as automotive electronics, aerospace, communications, medical, MiniLED, and smart instrumentation.
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    • Semiconductor Cleaning Equipment
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      GC860 SIP Inline Zero Wastewater Cleaning Machine | Flux Cleaning System

      GC860 SIP Inline Zero Wastewater Cleaning Machine for Flux Cleaning

      Semiconductor Cleaning Equipment, Wastewater-Free Cleaning System
      SIP Flux Cleaning | Zero Rinse Wastewater | Closed-Loop Liquid Recovery | Condensation Recovery | Multi-Stage Spray Cleaning | Hot Air Drying | SMEMA | Optional MES
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      Hot
      FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine
      FC610 BGA Inline Aqueous Cleaning Machine for Solder Ball Mount Flux Removal

      BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine FC610

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner
      The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning.It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
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      fc720-inline-cleaner fc720-inline-cleaner Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages
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      FC720 Inline PCBA & Flip Chip Cleaning Machine | Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

      FC720 is a new-generation inline spray cleaning machine independently designed and manufactured by ACTSPRAY for automatic flux residue removal from PCBA assemblies, SiP modules and low-gap flip chip packages.

      The system combines multi-stage chemical spray cleaning, chemical isolation, multi-stage DI water rinsing, air knife and hot air drying in one continuous inline process. Special spray nozzle combinations and adjustable upper/lower spray systems help cleaning liquids penetrate narrow gaps and remove flux residues from densely populated PCBA assemblies and low-standoff semiconductor packages.

      With a 600 mm-wide stainless steel mesh conveyor, adjustable conveyor speed and fully monitored cleaning parameters, FC720 provides a stable and repeatable cleaning process for automated electronics and semiconductor packaging production lines.

      Key Applications: PCBA Cleaning | SiP Cleaning | Flip Chip Cleaning | FCBGA Cleaning | FCCSP Cleaning | Low-Gap Package Cleaning | Flux Residue Removal
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      FC660 Inline Flip Chip semiconductor Cleaner

      FC660 Flip Chip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner
      FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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      DC260 JEDEC Tray Inline Cleaning Machine | Semiconductor Tray Cleaner

      DC260 JEDEC Tray Inline Cleaning Machine for Semiconductor Tray Cleaning

      Semiconductor Cleaning Equipment, Magazine&Carrier Cleaner

      JEDEC Tray Cleaning | DI Water Spray Wash | DI Water Rinse | Air Drying| Hot Air Drying | 600 mm Conveyor | SMEMA Integration | Optional MES

      The DC260 provides an automated and repeatable cleaning solution for reusable JEDEC trays, combining DI water spray washing, DI water rinsing, filtered air blow drying and hot air drying in one inline machine.

      Its 600 mm conveyor width accommodates large JEDEC trays, while adjustable conveyor speed and spray pressure allow the cleaning process to be optimized for different production requirements.

      For automated semiconductor manufacturing lines, SMEMA connectivity enables integration with tray loaders, unloaders and conveyors. Optional MES connectivity provides an additional solution for factory-level production monitoring.

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      FC700 Inline FlipChip Semiconductor Cleaner

      FC700 FlipChip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner
      FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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      FC960 Advanced Packaging Inline Cleaning Machine | FCBGA & FCCSP Cleaner

      FC960 SIP Inline Cleaning Machine for FCBGA FCCSP and 2.5D Advanced Packaging

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner
      FC960 Advanced Packaging Inline Cleaning Machine High-Performance Inline Flux Cleaning System for Large-Size, Low-Standoff FCBGA, FCCSP and SIP Packages FCBGA Cleaning | FCCSP Cleaning | SIP Cleaning | 2.5D Packaging | Low-Standoff Flux Removal | 3-Stage Chemical Washing | Multi-Stage DI Rinse | Hot Air Drying | SMEMA | MES / SECS-GEM
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      FC800 Inline Cleaning System for Semiconductor FCBGA, FCCSP & 2.5D3D Packaging Automatic PCB Cleaner
      spertar-advanced semiconductor cleaning solution provider

      FlipChip Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging Automatic PCB Cleaner FC800

      Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

      The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.

      Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.

      With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.

      The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.

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    • SMT Cleaning Equipment
      BC310 Pneumatic SMT Stencil Cleaner for Solder Paste Stencil Cleaning
      BC310 Pneumatic SMT Stencil Cleaner for SMT PCB Assembly Solder Paste Stencil Cleaning

      Pneumatic SMT Stencil Cleaner | Solder Paste Stencil Cleaning Machine BC310

      SMT Cleaning Equipment, SMT Stencil Cleaner
      The BC310 Pneumatic Stencil Cleaner is designed for fast, safe, and efficient cleaning of SMT stencils, removing solder paste and flux residue to ensure consistent printing performance and higher yield.
      ✅ 100% pneumatic operation (no electricity required)
      ✅ 360° high-pressure spray cleaning system
      ✅ Compatible with solvent and water-based cleaning liquids
      ✅ Improve SMT printing quality & reduce defects
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      BC310D Pneumatic Dual-lane Stencil Cleaner SMT

      Pneumatic Dual-lane Stencil Cleaner SMT Printer Stencil Cleaning Machine BC310D

      SMT Cleaning Equipment, SMT Stencil Cleaner
      The BC310D is a pneumatic dual-chamber SMT stencil cleaning machine designed for high‑efficiency cleaning of solder paste and red glue stencils. With two independent cleaning systems, 1μm filtration, and fully pneumatic operation, it delivers maximum productivity, safety, and long-term reliability for SMT production lines.
      ✅ Dual independent cleaning systems clean 2 stencils simultaneously
      ✅ 100% pneumatic operation (no electricity required)
      ✅ 360° high-pressure spray cleaning system
      ✅ Compatible with solvent and water-based cleaning liquids
      ✅ Improve SMT printing quality & reduce defects
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      BC320 Stencil Electric Cleaner SMT

      Electric SMT Stencil Cleaner Automatic Solder Paste Stencil Cleaning Machine BC320

      SMT Cleaning Equipment, SMT Stencil Cleaner
      The BC320 electric SMT stencil cleaning machine uses a three‑stage process—spray cleaning, DI water rinsing, and hot‑air drying—to clean solder paste stencils, red glue stencils, and misprinted PCBs with high precision. Fully automated, water‑based, and built with SUS304 stainless steel.
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      BC210 coating pallet cleaner
      BC210 Fixture Cleaning Machine for wave soldering fixtures and reflow oven condensers

      Coating Pallet Fixture Cleaning Machine for SMT Production Line Maintenance BC210

      SMT Cleaning Equipment, SMT Pallet Cleaner
      BC210 Coating Pallet Cleaning Machine for wave soldering fixtures, reflow oven condensers, claws, chains and PCBA tooling. Water‑based chemcial liquid cleaning, full‑coverage spray, tape water or DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
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      BC220 Reflow Oven Condenser Cleaner SMT

      Reflow Oven Condenser Chiller Cleaning Machine for SMT Production Line Maintenance BC220

      SMT Cleaning Equipment, Reflow Condenser Cleaner
      BC210 Pallet Cleaning Machine for wave soldering pallet, reflow oven condensers chiller, claws, chains, filters and PCBA tooling. PLC control, water‑based chemcial liquid cleaning, full‑coverage spray, tape water / DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
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      SMT Squeegee Auto Cleaning Machine Solder Paste Squeegee Blade Cleaner BC410

      SMT Cleaning Equipment, SMT Squeegee Cleaner
      The BC410 Squeegee Cleaning Machine features an integrated ultrasonic and spray cleaning system. It follows a standard three-step workflow: washing with water-based solder paste cleaning fluid, rinsing with DI water, and hot air drying. Each batch can clean 6 to 12 squeegees efficiently. During operation, the squeegees are securely mounted on a special synchronous rotating fixture. This rotating design ensures thorough cleaning of all surfaces, including squeegee gaps, fixture contact areas, and both ends, achieving dead-angle-free cleaning. The result is complete removal of solder paste residues, restoring the squeegees' accuracy for immediate reuse in production.
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      Automatic Solder Feeding Device Cleaning Machine BC420 Customized

      SMT Cleaning Equipment, SMT Squeegee Cleaner
      The BC420 is professionally designed to clean automatic solder paste feeding devices. During operation, the automatic solder paste feeding device is fixed onto a rotating bracket inside the cleaning chamber, which keeps rotating throughout the process. Combining the physical force of ultrasonic vibration and high-pressure spraying, together with the chemical dissolving power of water-based solder paste cleaning solution, the BC420 decomposes and removes residual solder paste from surfaces, corners and narrow gaps of the feeding device until thoroughly clean. After cleaning, rinse the unit with DI water or purified tap water, followed by hot air drying to completely eliminate remaining moisture on the device.
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      BC30 SMT Nozzle Cleaning Machine for Pick and Place Nozzle

      SMT Cleaning Equipment, SMT Nozzle Cleaner
      BC30 Nozzle Cleaning Machine adopts a multi-nozzle atomized water jet cleaning method to thoroughly remove residual solder paste from nozzles. The equipment features fully automatic cleaning, capable of processing 30 nozzles per cycle. Different nozzle models are matched with corresponding fixture trays, enabling compatibility with nozzles of all placement machine models. After cleaning, the nozzles are automatically dried with compressed air.
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    • Cleaning Support Equipment
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      Female Thread Ball Valve for KEDTech Cleaning Machine Spare Part P/N WGW.01.01.028

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      Explosion-Proof Solvent Recovery Machine, Industrial Distillation Solvent Recycler

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      Cleaning Support Equipment, Wastewater Treatment System
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  • Applications
    • Electronics Assembly Cleaning
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DC260 JEDEC Tray Inline Cleaning Machine | Semiconductor Tray Cleaner
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Home Semiconductor Cleaning Equipment Magazine&Carrier Cleaner DC260 JEDEC Tray Inline Cleaning Machine for Semiconductor Tray Cleaning
BC710 Inline PCBA Cleaning Machine | Automatic PCB Flux Cleaner
BC710 Inline PCBA Cleaning Machine | Automatic PCB Flux Cleaner
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DC760 SMT Magazine Inline Cleaning Machine | PCB Magazine Cleaner
DC760 SMT Magazine Inline Cleaning Machine PCB Magazine Cleaner

DC260 JEDEC Tray Inline Cleaning Machine for Semiconductor Tray Cleaning

JEDEC Tray Cleaning | DI Water Spray Wash | DI Water Rinse | Air Drying| Hot Air Drying | 600 mm Conveyor | SMEMA Integration | Optional MES

The DC260 provides an automated and repeatable cleaning solution for reusable JEDEC trays, combining DI water spray washing, DI water rinsing, filtered air blow drying and hot air drying in one inline machine.

Its 600 mm conveyor width accommodates large JEDEC trays, while adjustable conveyor speed and spray pressure allow the cleaning process to be optimized for different production requirements.

For automated semiconductor manufacturing lines, SMEMA connectivity enables integration with tray loaders, unloaders and conveyors. Optional MES connectivity provides an additional solution for factory-level production monitoring.

Categories: Magazine&Carrier Cleaner, Semiconductor Cleaning Equipment Tags: Automated JEDEC Tray Cleaning System, Automatic Tray Cleaning Machine, Electronic Component Tray Cleaner, IC Tray Cleaning Machine, Inline Semiconductor Cleaning Equipment, Inline Tray Cleaning Machine, JEDEC Tray Cleaner, JEDEC Tray Cleaning Machine, JEDEC Tray Inline Cleaning Machine, JEDEC Tray Washer, Semiconductor Packaging Cleaning Equipment, Semiconductor Packaging Tray Cleaning, Semiconductor Tray Cleaner, Semiconductor Tray Cleaning Machine, Semiconductor Tray Washing Machine, Tray Dust Cleaning Machine, Tray Particle Cleaning Machine Brand: ACTSPRAY
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  • Description
Description

DC260 JEDEC Tray Inline Cleaning Machine

Automated Water Spray Cleaning System for JEDEC Trays

The ACTSPRAY DC260 JEDEC Tray Inline Cleaning Machine is an automated inline cleaning system designed to remove dust, particles and other surface contaminants from JEDEC trays used in semiconductor packaging and electronic component manufacturing.

The DC260 uses a stainless steel mesh conveyor to continuously transport JEDEC trays through a complete DI water wash → DI water rinse → air blow → hot air drying process. Tray transfer, cleaning, rinsing and drying are performed automatically at the preset conveyor speed.

With a 600 mm wide conveyor and support for trays up to 600 × 400 × 100 mm, the DC260 is suitable for automated tray cleaning applications in semiconductor packaging, IC assembly, electronics manufacturing and component handling processes.

The machine can be integrated with upstream and downstream loaders, unloaders and conveyors through SMEMA interfaces, allowing the DC260 to form a fully automated JEDEC tray cleaning line. Optional MES connectivity is also available for production monitoring and equipment status management.


Key Applications

The DC260 is designed for cleaning reusable JEDEC trays and semiconductor packaging trays used in automated manufacturing environments.

Typical applications include:

  • JEDEC tray cleaning
  • Semiconductor tray cleaning
  • IC packaging tray cleaning
  • Semiconductor component tray cleaning
  • Electronic component tray cleaning
  • Dust and particle removal
  • Reusable tray cleaning
  • Semiconductor packaging production
  • IC assembly and testing
  • Automated material handling systems

Cleaning Process

The DC260 uses a four-stage inline cleaning process:

DI Water Wash → DI Water Rinse → Air Blow Drying → Hot Air Dry

1. DI Water Wash

DI water is sprayed onto the JEDEC tray to remove dust, particles and surface contaminants.

The wash spray pressure can be adjusted according to the tray material and cleaning requirements.

2. DI Water Rinse

A dedicated DI water rinse section removes residual particles and contaminants remaining after the wash process.

3. Air Blow Drying

High-volume air blow removes water from the tray surface and prepares the tray for the final drying stage.

4. Hot Air Dry

Hot air drying removes residual moisture before the cleaned tray exits the machine.

The hot air temperature can be adjusted up to 80°C according to the production requirements.


Key Features

1. Stainless Steel Construction

The machine uses a robust stainless steel frame and stainless steel components.

The construction provides good mechanical strength and resistance to acid and alkali corrosion, making the DC260 suitable for continuous industrial operation.

2. Stainless Steel Mesh Conveyor

JEDEC trays are transported through the machine using a stainless steel mesh conveyor.

The conveyor speed is adjustable from: 0.1–1.5 m/min

This allows the cleaning cycle time to be adjusted according to tray contamination and production requirements.

3. Complete Inline Cleaning Process

The DC260 integrates four process stages into one continuous system:

Wash → Rinse → Air Blow Drying → Hot Air Dry

No manual transfer between cleaning stages is required.

4. Adjustable Spray Pressure

The DI water spray pressure can be adjusted to optimize cleaning performance for different tray designs and contamination levels.

Digital pressure meters provide visual monitoring of the spray and air blow pressure in each relevant section.

5. Independent Wash Pump and Filtration

The wash section is equipped with electric pumps and inline filters to maintain stable water circulation and help remove particles from the cleaning water.

6. Filtered Air Blow and Drying

The air blow and hot air drying sections are equipped with dedicated air blowers and inline FFU filtration.

This helps provide cleaner drying air and reduces the risk of secondary particle contamination after washing.

7. PC + PLC Control

The DC260 uses PC + PLC control with a Windows 10-based English operation interface.

Operators can monitor equipment operation and adjust key process parameters through the control system.

8. Automatic Tray Detection

Sensors are installed at the machine input and output sections to provide automatic tray detection and production monitoring.

Functions include:

  • Tray detection
  • Tray counting
  • Timeout detection
  • Standby operation
  • Energy-saving operation

9. SMEMA Connectivity

SMEMA signal lines allow the DC260 to connect with:

  • Tray loaders
  • Tray unloaders
  • Automated conveyors
  • Upstream equipment
  • Downstream equipment

This allows the machine to be integrated into an automated tray cleaning line.

10. Optional MES Connectivity

An optional MES connection software package allows customers to monitor machine working conditions through their manufacturing execution system.

MES integration can support centralized production monitoring and equipment management.

11. Energy-Saving Mode

The DC260 incorporates an energy-saving mode to reduce power consumption during standby or low-production conditions.

12. Multiple Safety Protection Functions

The machine includes multiple protection functions for reliable industrial operation:

  • Power supply phase-loss protection
  • Phase-sequence protection
  • Motor over-current protection
  • Motor overload protection
  • Water heating over-temperature protection
  • Air heating over-temperature protection
  • Water high-level protection
  • Water low-level protection
  • Automatic water leakage detection

13. Integrated Water Leakage Protection

The machine uses a two-layer bottom structure to provide additional protection against water leakage.

The design eliminates the need for an external water collection tray under normal operating conditions.


Basic Technical Specifications

ItemSpecification
ModelDC260
BrandACTSPRAY
Tray SizeW600 × L400 × H100 mm
Conveyor Mesh Width600 mm
Conveyor Mesh Speed0.1–1.5 m/min
Transfer DirectionLeft to Right
Conveyor Height920 ± 25 mm
Wash DI Water TemperatureRT–60°C
Rinse DI Water TemperatureRT
Air Blow TemperatureRT
Hot Air Drying TemperatureRT–80°C
DI Water Supply6–15 L/min
Air Volume30 m³/min
Air Vents3 × 250 mm
Total Power51 kW
Power SupplyAC 380 V, 3 Phase, 50 Hz
Compressed Air Supply0.5–0.7 MPa
Compressed Air Consumption200 L/min
Machine DimensionsL2600 × W1800 × H1700 mm
Machine WeightApprox. 2000 kg
Control SystemPC + PLC
Operation InterfaceWindows 10, English
MES ConnectionOptional
SMEMA InterfaceStandard

RT = Room Temperature. Actual cleaning parameters may be adjusted according to tray material, contamination level and production requirements.

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    fc720-inline-cleaner fc720-inline-cleaner Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages
    pcb inline cleaning system spertar clean

    FC720 Inline PCBA & Flip Chip Cleaning Machine | Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages

    Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

    FC720 is a new-generation inline spray cleaning machine independently designed and manufactured by ACTSPRAY for automatic flux residue removal from PCBA assemblies, SiP modules and low-gap flip chip packages.

    The system combines multi-stage chemical spray cleaning, chemical isolation, multi-stage DI water rinsing, air knife and hot air drying in one continuous inline process. Special spray nozzle combinations and adjustable upper/lower spray systems help cleaning liquids penetrate narrow gaps and remove flux residues from densely populated PCBA assemblies and low-standoff semiconductor packages.

    With a 600 mm-wide stainless steel mesh conveyor, adjustable conveyor speed and fully monitored cleaning parameters, FC720 provides a stable and repeatable cleaning process for automated electronics and semiconductor packaging production lines.

    Key Applications: PCBA Cleaning | SiP Cleaning | Flip Chip Cleaning | FCBGA Cleaning | FCCSP Cleaning | Low-Gap Package Cleaning | Flux Residue Removal
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    fc730 inline cleaning machine advanced packaging cleaning machine for fcBGA SiP and chiplet semiconductor manufacturing
    pcb inline cleaning system spertar clean

    FC730 Inline Cleaning Machine for FCBGA Semiconductor Packaging Flux Removal Automatic PCB Cleaner

    Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

    FC730 is FCBGA or SIP flux auto cleaning system, engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC730 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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    FC760 pcba inline cleaning machine
    spertar-advanced semiconductor cleaning solution provider

    FC760 Inline PCBA Cleaning Machine for Flux Residue Removal in High Volume SMT Production

    Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

    The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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    FC800 Inline Cleaning System for Semiconductor FCBGA, FCCSP & 2.5D3D Packaging Automatic PCB Cleaner
    spertar-advanced semiconductor cleaning solution provider

    FlipChip Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging Automatic PCB Cleaner FC800

    Semiconductor Cleaning Equipment, Advanced Packaging Cleaner

    The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.

    Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.

    With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.

    The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.

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    Hot
    GC860 SIP Inline Zero Wastewater Cleaning Machine | Flux Cleaning System

    GC860 SIP Inline Zero Wastewater Cleaning Machine for Flux Cleaning

    Semiconductor Cleaning Equipment, Wastewater-Free Cleaning System
    SIP Flux Cleaning | Zero Rinse Wastewater | Closed-Loop Liquid Recovery | Condensation Recovery | Multi-Stage Spray Cleaning | Hot Air Drying | SMEMA | Optional MES
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      ACTSPRAY logo 1096x141 T W

      Precision cleaning equipment supplier.

      • No.74, Zhen'an East Road, Dongguan city, Guangdong, 523000, China
      • Phone: 8618938054154
      • Email: wendywu@actspray.com
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        IGBT Flux Residue Removal Before Wire Bonding
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