Deep Flux Cleaning for PCBA & Low-Gap Packages

As component density increases and package gaps become smaller, flux residues become increasingly difficult to remove.

Flux may remain:

• Between densely populated components
• Under low-standoff components
• Inside FCBGA and FCCSP gaps
• Around fine-pitch solder joints
• On the bottom surface of semiconductor packages

These residues can affect electrical reliability, cleanliness and downstream processes.

FC720 addresses these challenges through the combination of:

Chemical Action + Mechanical Spray Action + Multi-Stage Rinsing + Controlled Drying

The heated cleaning solution helps soften and chemically break down flux residues, while high-pressure spray mechanically removes the softened contamination from the product surface and difficult-to-reach areas.

Multi-Stage Cleaning for Difficult Flux Residues

FC720 features three independent chemical cleaning sections, each approximately 630 mm long, providing a total cleaning length of 1,890 mm.

Each cleaning section is equipped with an independent pump to provide stable spray pressure and sufficient cleaning flow.

The combination of extended cleaning time, heated cleaning chemistry and mechanical spray action helps:

Soften → Decompose → Dislodge → Remove

flux residues from PCBA assemblies and low-gap flip chip packages.

Adjustable Spray Configuration

The spray bars can be configured in different orientations according to the product structure.

• Upper and lower spray cleaning
• Adjustable spray pressure
• Adjustable spray angle
• Multiple special nozzle configurations
• Horizontal or longitudinal spray bar arrangement
• Independent pump for each cleaning section

This configuration helps improve spray coverage around dense components and narrow package gaps.

Designed for Low-Gap Flip Chip Cleaning

Low-gap packages such as FCBGA and FCCSP can present significant cleaning challenges because flux residues may accumulate in narrow spaces beneath the package.

FC720 uses specially selected spray nozzles and adjustable spray-bar configurations to improve cleaning liquid penetration into these areas.

Suitable for:

• Flip Chip packages
• FCBGA
• FCCSP
• SiP modules
• Low-standoff semiconductor packages
• Fine-pitch PCBA assemblies
• High-density electronic assemblies

The cleaning process can be optimized according to package structure, contamination type, flux chemistry and required cleanliness level.

Complete Inline Cleaning Process

Process Flow

Loading → Chemical Cleaning 1 → Chemical Cleaning 2 → Chemical Cleaning 3 → Chemical Isolation → DI Water Pre-Rinse → DI Water Rinse 1 → DI Water Rinse 2 → Final DI Water Rinse → Air Knife → Hot Air Drying 1 → Hot Air Drying 2 → Unloading

1. Chemical Cleaning 1

The first cleaning stage begins the removal of flux residues using heated chemical cleaning solution and spray action.

2. Chemical Cleaning 2

A second independent cleaning stage provides additional cleaning time and spray energy for stubborn flux residues.

3. Chemical Cleaning 3

The third cleaning stage completes the main flux removal process and improves cleaning consistency for difficult contamination.

4. Chemical Isolation

A high-pressure blower and upper/lower air knives remove residual cleaning liquid from the product and minimize chemical carryover into the rinsing sections.

5. DI Water Pre-Rinse

The first DI water stage removes remaining cleaning solution from the product surface.

6. DI Water Rinse 1 & 2

Multiple DI water rinsing stages progressively remove residual chemicals and reduce ionic contamination.

7. Final DI Water Rinse

The final rinse uses controlled DI water to provide the required surface cleanliness before drying.

8. Air Knife

High-pressure air removes surface water and reduces the moisture load entering the drying section.

9. Hot Air Drying 1 & 2

Two-stage hot air drying removes residual moisture from the PCBA or semiconductor package before it enters the next production process.

5-Stage DI Water Rinsing System

FC720 is equipped with an extended multi-stage DI water rinsing system to improve rinsing efficiency and reduce chemical carryover.

The rinsing system features:

• DI water resistivity monitoring
• Electronic flow monitoring
• Adjustable water temperature
• Multiple DI water rinse stages
• Rear-to-front overflow water renewal
• Final DI water rinse

The rear-to-front overflow design progressively improves water cleanliness toward the final rinsing stage, helping reduce ionic contamination while controlling DI water consumption.

Continuous Inline Cleaning with Stable Throughput

FC720 uses a 600 mm-wide stainless steel mesh conveyor for continuous product transfer.

The conveyor speed can be adjusted from:

0.05–1.5 m/min

For example, when cleaning 300 × 250 mm products, with the 300 mm side positioned in the conveying direction, a conveyor speed of 30 cm/min and approximately 10 mm spacing allow two products to be processed side by side.

The theoretical throughput is approximately:

116 pcs/hour

Actual production capacity depends on product dimensions, loading arrangement, spacing, cleaning requirements and process parameters.

This continuous conveyor design allows FC720 to operate as part of an automated production line.

Real-Time Process Monitoring & Control

FC720 uses an Industrial PC + PLC control system with a Windows-based operating interface.

Key process parameters can be digitally controlled, monitored and recorded.

Cleaning Parameters

• Conveyor speed
• Pre-cleaning pressure
• Chemical cleaning pressure
• Pre-rinse pressure
• Rinse 1 pressure
• Rinse 2 pressure
• Final rinse pressure
• Chemical isolation air pressure
• Air knife pressure
• Cleaning solution temperature
• Pre-rinse water temperature
• Rinse water temperature
• Final DI water temperature

Pressure and temperature parameters are monitored in real time, with upper/lower limit alarms to help maintain process stability.

Industrial PC + PLC Control

The FC720 control system provides centralized management of machine operation and process parameters.

Standard Control Functions

• Industrial PC + PLC control
• Windows operating system
• Chinese/English interface
• Real-time parameter monitoring
• Pressure monitoring and alarms
• Temperature monitoring and alarms
• Liquid level monitoring
• Leak detection
• Over-temperature protection
• Energy-saving standby mode
• Product in/out detection
• Product tracking
• MES connectivity

Optional cleaning solution concentration monitoring and automatic compensation can be added for applications requiring tighter chemical process control.

Built for Long-Term Industrial Cleaning

The machine body is constructed from SUS304 stainless steel using integrated argon arc welding.

The structure provides:

• High structural rigidity
• Corrosion resistance
• Heat resistance
• Chemical resistance
• Long-term durability
• Easy cleaning and maintenance

The liquid tanks use reinforced welded construction for reliable long-term operation with heated chemical cleaning solutions.

Reduce Cleaning Chemical Consumption

FC720 incorporates several features designed to reduce operating costs.

Dual-Stage Condensation Recovery

The cleaning system uses a two-stage extended condensation recovery system to recover a significant portion of evaporated cleaning solution.

Automatic Chemical Addition

A dedicated concentrated chemical tank and diaphragm pump allow automatic addition and discharge of cleaning solution.

Controlled DI Water Supply

An electronic flow meter monitors DI water consumption in real time, helping maintain cleaning quality while controlling water usage.

Energy-Saving Mode

The machine can automatically enter an energy-saving standby state when products are not detected.

Safety & Production Protection

FC720 incorporates multiple protection systems for reliable industrial operation.

Safety Features

• Liquid leakage detection
• Water leakage detection
• Automatic alarm and shutdown
• Double-layer bottom structure
• Liquid collection tray
• High/low liquid-level protection
• PID temperature control
• Dual temperature sensors
• EGO over-temperature protection
• Phase-loss protection
• Phase-sequence protection
• Electrical overload protection
• Surge protection
• Leakage protection switch
• Multiple emergency-stop switches

These systems help protect operators, equipment and production products during continuous operation.

Smart Factory & MES Integration

FC720 can be integrated into automated production lines and smart factory systems.

The machine supports:

• Product barcode scanning
• Product traceability
• MES integration
• SECS/GEM communication
• SMEMA signal interface
• Upstream/downstream equipment communication
• Product entry/exit detection
• Process data monitoring

The system can record product and process information to support production traceability and process management.

FC720 Technical Specifications

FC720 Key Features at a Glance

3-Stage Extended Chemical Cleaning

Three independent cleaning sections with a total cleaning length of 1,890 mm provide extended cleaning time for difficult flux residues.

Multi-Nozzle Spray System

Special nozzle combinations improve spray coverage around dense components and narrow package gaps.

Adjustable Upper & Lower Spray

Spray pressure and spray angle can be adjusted according to different PCBA and semiconductor package structures.

Multi-Stage DI Water Rinsing

Extended DI water rinsing progressively removes residual cleaning chemicals and ionic contamination.

600 mm Stainless Steel Mesh Conveyor

Continuous product conveying supports automated production and allows two 300 mm-wide products to be processed side by side.

Real-Time Process Monitoring

Pressure, temperature, DI water flow, resistivity and other key parameters can be monitored in real time.

Automated Chemical Management

Automatic chemical addition and discharge simplify chemical management and improve process consistency.

MES & SECS/GEM Connectivity

Barcode tracking, MES integration, SMEMA and SECS/GEM communication support smart factory production.

From Flux Residue to Clean, Dry Products

FC720 integrates the complete cleaning process into one automated system:

Chemical Cleaning → Chemical Isolation → DI Water Rinsing → Air Knife → Hot Air Drying

Products enter from the loading end and continuously pass through each process section according to the programmed conveyor speed.

After cleaning and drying, the PCBA or semiconductor package exits the machine ready for the next manufacturing process.

FC720 can also be connected with automatic loading/unloading and conveyor systems to create a complete automated inline cleaning line.

Certificate