FC610 Inline Flux Cleaning Machine for BGA
Key Features of FC610 In-line Aqueous Cleaning System
1. Intelligent PC + PLC Control System with MES Integration
FC610 adopts an advanced PC + PLC integrated control system with a Windows-based English operation interface and optional MES connectivity for smart factory automation.
2. Precision Upper and Lower Spray Manifold System
The FC610 inline cleaning system utilizes upper and lower precision spray manifolds designed to achieve effective water-soluble flux residue removal from BGA packages and carrier plates.
3. Adjustable Air Blow and Hot Air Drying Knife System
FC610 integrates an advanced air blow and hot air drying system to ensure complete moisture removal after the cleaning and rinsing process.
4. DI Water Filter and FFU Air Filtration System
The system is equipped with high-efficiency DI water filtration and FFU (Fan Filter Unit) air filtration technology to maintain clean process conditions.
5. DI Water Resistivity Monitoring System
FC610 includes an advanced DI water resistivity monitoring system to ensure high-purity cleaning conditions throughout the production process.
6. Automatic DI Water Spray Pressure Monitoring
The system incorporates automatic DI water spray pressure monitoring meters for stable and repeatable cleaning performance.
7. Double-Layer Kevlar Mesh Belt Conveyor
FC610 utilizes a durable double-layer Kevlar mesh belt conveyor system specifically designed for inline semiconductor BGA cleaning applications, it effectively prevents BGAs from spring out the pallet during spray cleaning.
8. Automatic Water Leakage Detection Device
The machine is equipped with an automatic water leakage detection system to improve operational safety and equipment protection.
9. SMEMA Signal Communication Interface
FC610 supports SMEMA signal line communication for seamless connection with upstream and downstream SMT and semiconductor manufacturing equipment.
10. SECS/GEM Software (Optional)
Optional SECS/GEM communication software enables integration with semiconductor factory automation systems and Industry 4.0 manufacturing environments.
Technical Specification
| No. | Item | Spec |
| 1 | Substrate size | W600*L400*T3.5(mm) |
| 2 | Kevlar net width | 600mm |
| 3 | Conveyor speed | 0.1~1.5m/Min |
| 4 | Conveyor direction | left to right |
| 5 | Conveyor net height | 920±25mm |
| 6 | Wash temp.(DI water) | RT~70℃ |
| 7 | Rinse temp.(DI water) | RT~70℃ |
| 8 | Final rinse temp.(DI water) | RT~60℃ |
| 9 | Hot air dry temperature | RT~100℃ |
| 10 | DI water supply | 6~12L/Min |
| 11 | Air volume | 36m³/Min (3* 250mm air vents) |
| 12 | Total power | ≈106KW |
| 13 | Power supply | AC380V, 3P, 50HZ |
| 14 | Air supply | 0.5~0.7Mpa, 200L/Min |
| 15 | Machine size | L3500*W1850*H1950(mm) |
| 16 | Machine weight | About 2200KG |
Frequently Asked Questions
1. What types of flux residues can FC610 remove?
FC610 is designed to remove water soluble flux residues.
2. Is FC610 suitable for low standoff semiconductor packages?
No. FC610 is specifically design for BGA solder ball cleaning, there have double layer kevlay mesh belt to keep the bga smoothy and stable to go through spray area.
3. Can FC610 support inline automated production?
Yes. FC610 is a fully automated inline cleaning system designed for continuous production environments.
BGA ball-planting substrate is transferred from system’s input side to net conveyor, passes through DI water wash section, DI water rinse section, DI water final rinse section, air blow dry section and send out from output side automatically in sequence at the setting net speed.
4. Does FC610 support customized cleaning processes?
Yes. Adjustable process parameters allow the system to support different package structures, and manufacturing requirements.
Certificate
Why Choose us
ACTSPRAY provides midle-high-class cleaning equipment solutions for the SMT and semiconductor industries.
– We have advanced and automated cleaning and drying technologies for perfect cleaning results.
– We made standard machines & custom solutions fully meet varied production needs.
– We have professional after-sales team provides all-round reliable support.
– We own proven rich experience in serving mainstream semiconductor manufacturers worldwide.
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