Power semiconductor devices such as IGBT, IPM, and power modules require strict contamination control to ensure electrical performance and long-term reliability.
During soldering, die attach, and assembly processes, flux residues and manufacturing contaminants may remain on leadframes, substrates, and package surfaces. Without effective cleaning, these residues can cause insulation problems, corrosion, and premature device failure.
Our ultrasonic and spray cleaning technologies combine powerful contamination removal with precise process control, helping manufacturers improve product reliability and production yield.
Need Help On Your Cleaning Process?
Every manufacturing process has unique contamination challenges. ACTSPRAY provide professional cleaning solutions based on your product requirements, cleanliness standards, and production conditions.
