FC960 Advanced Packaging Inline Cleaning Machine

High-Performance Inline Flux Cleaning System for Large-Size, Low-Standoff FCBGA, FCCSP and SIP Packages

The ACTSPRAY FC960 Advanced Packaging Inline Cleaning Machine is a high-performance automated spray cleaning system specifically developed for removing flux residues from the underside of large-size, low-standoff advanced semiconductor packages, including FCBGA, FCCSP, SIP and 2.5D packaging assemblies.

Low-standoff packages present significant cleaning challenges because flux residues can become trapped in narrow gaps beneath packages and around high-density interconnections. The FC960 addresses these challenges with an extended multi-stage washing section, multi-nozzle spray configuration, adjustable upper and lower spray pressure, controlled chemical isolation, extended multi-stage DI water rinsing and two-stage hot air drying.

The system uses a stainless steel mesh conveyor and PC + PLC control architecture. Product assemblies are automatically transferred through the complete cleaning process at a preset conveyor speed.

All major process parameters—including washing temperature, rinse temperature, washing spray pressure, rinse spray pressure, chemical isolation air pressure, air drying pressure and hot air drying pressure and temperature—can be set, adjusted and monitored through the control software.

The FC960 can be connected to reflow ovens, automatic transfer systems and upstream/downstream production equipment to form a fully automated advanced packaging cleaning line.

Key Applications

The FC960 is designed for high-performance cleaning of advanced semiconductor and electronic packages, particularly products with large package sizes and low standoff gaps.

Typical applications include:

FCBGA Flux Cleaning
FCCSP Flux Cleaning
SIP Package Cleaning
2.5D Package Cleaning
Advanced Semiconductor Packaging Cleaning
Flip-Chip Package Cleaning
Large-Size Package Cleaning
Low-Standoff Package Cleaning
Bottom-Side Flux Removal
Semiconductor Assembly Cleaning
Post-Soldering Flux Cleaning
High-Reliability Package Cleaning

Advanced Packaging Cleaning Challenge

As advanced semiconductor packages become larger and interconnection density increases, the gap beneath the package can become extremely small.

Flux residues remaining underneath low-standoff packages can be difficult to remove using conventional cleaning equipment.

Typical challenges include:

Low standoff height
Large package dimensions
High-density interconnections
Flux trapped beneath packages
Difficult spray access
High cleanliness requirements
Risk of residual ionic contamination

The FC960 is designed specifically around these challenges.

Its extended washing section, multiple spray nozzle configurations, adjustable spray angles and pressures, multi-stage rinsing and controlled drying provide a process designed for demanding advanced packaging applications.

Cleaning Process

The FC960 uses a complete automated inline process:

Loading → Pre-Washing→ Washing 1 → Washing 2 → Washing 3 → Chemical Isolation → Pre-Rinse → Rinse 1 → Rinse 2 → Rinse 3 → Final Rinse → Air Drying → Hot Air Drying → Unloading

1. Pre-Washing

The pre-washing stage provides initial softening and removal of flux residues before the main washing stages.

2. Washing 1 / Washing 2 / Washing 3

The FC960 uses an extended three-stage washing system.

Heated washing chemistry and high-pressure spray action work together to:

Soften flux residues
Chemically break down contaminants
Physically dislodge residues
Remove contaminants from package surfaces
Improve cleaning access beneath low-standoff packages

The spray system uses multiple nozzle configurations to improve cleaning coverage.

Washing spray pressure and spray angles can be adjusted according to package design and process requirements.

3. Chemical Isolation

After chemical washing , an adjustable air knife system separates the cleaning liquid from the subsequent rinse stages.

Both air pressure and air knife angle can be adjusted.

This helps reduce chemical carryover and improves rinse efficiency.

4. Pre-Rinse

The pre-rinse section removes remaining washing chemistry before the main DI water rinsing stages.

5. Rinse 1 / Rinse 2 / Rinse 3 / Final Rinse

The FC960 uses an extended multi-stage DI water rinsing system consisting of:

Pre-rinse
Rinse 1
Rinse 2
Rinse 3
Final rinse

The rinse water is refreshed through a rear-to-front overflow configuration, providing continuous water renewal and strong rinsing capability.

DI water inlet pressure, flow rate and resistivity are continuously monitored.

6. Air Drying

The air drying stage removes residual DI water from the package surface before thermal drying.

Air knife pressure and angle can be adjusted.

7. Two-Stage Hot Air Drying

The FC960 uses a two-stage high-temperature hot air drying system.

The drying temperature can be independently configured for each stage.

The system removes residual moisture from the package before the cleaned product exits the machine.

Key Features

1. Designed for Low-Standoff Advanced Packaging

The FC960 is specifically designed for difficult-to-clean packages such as:

FCBGA
FCCSP
SIP
2.5D packages

The extended washing section and multi-nozzle configuration provide enhanced cleaning capability for flux residues trapped beneath low-standoff packages.

2. Modular Machine Configuration

The machine uses a modular configuration:

Module 1: Washing + Chemical Isolation

Module 2: Rinsing + Air Drying+ Hot Air Drying

This modular architecture simplifies equipment layout, maintenance and process configuration.

3. Extended Washing Section

The FC960 incorporates an extra-long washing section designed specifically for demanding advanced packaging applications.

Three washing stages provide extended process time and multiple spray exposures for difficult flux removal applications.

4. Multi-Nozzle Spray Configuration

Specially configured spray nozzles are used for washing and rinsing advanced packaging products.

The system provides upper and lower spray coverage with adjustable:

Spray pressure
Spray angle
Process parameters

This allows the washing process to be optimized for different package structures.

5. Closed-Loop Washing Liquid Management

The washing system incorporates washing liquid circulation and filtration.

Automatic addition and drainage of washing liquid and concentrated chemistry simplify chemical management during production.

A dedicated condensation recovery system helps recover washing liquid from process vapors and significantly reduce liquid consumption.

6. DI Water Quality Monitoring

The rinse water system continuously monitors:

DI water pressure
DI water flow rate
DI water resistivity

The DI water supply specification supports resistivity of ≥15 MΩ·cm.

This provides better control of rinse water quality for high-cleanliness advanced packaging applications.

7. Extended Multi-Stage Rinsing

The FC960 uses an extended rinsing section with multiple rinse stages.

Rinse water flows from the rear toward the front through controlled overflow renewal.

This provides strong rinsing capability and helps remove residual cleaning chemistry and dissolved contaminants.

8. Adjustable Chemical Isolation

The chemical isolation and air drying sections feature adjustable air knife:

Pressure
Angle

The system provides electronic pressure monitoring for stable process control.

9. Two-Stage Hot Air Drying

The final drying system uses two stages of high-temperature hot air drying.

The temperature can be independently adjusted to meet different package material and drying requirements.

10. Real-Time Process Monitoring

The control system provides real-time monitoring of:

Conveyor speed
Cleaning spray pressure
Rinse spray pressure
Chemical isolation air pressure
Air drying pressure
Hot air drying pressure
Cleaning liquid temperature
Rinse water temperature
Hot air drying temperature

All major parameters can be displayed, set and adjusted through the operating software.

11. PC + PLC Control

The FC960 uses an industrial PC + PLC control architecture with a bilingual Chinese/English interface.

The control system provides centralized process management, parameter monitoring, alarm management and equipment operation.

12. Automatic Leakage Detection

The integrated machine base provides automatic detection of cleaning liquid and water leakage.

If abnormal leakage is detected, the system can generate an alarm and stop the machine to protect equipment and operators.

13. Advanced Temperature Protection

The heating system uses PID temperature control and dual temperature sensors.

The FC960 provides both electronic and mechanical over-temperature protection.

This helps prevent overheating and protects the cleaning liquid, rinse system and heating components.

14. Liquid Level Protection

Cleaning and rinse tanks are equipped with liquid-level float protection.

The system provides high- and low-level protection and helps prevent heater dry-running.

The liquid level detection system is designed to minimize the influence of bubbles on level detection.

15. SMEMA Connectivity

Standard SMEMA signal lines allow the FC960 to communicate with upstream and downstream production equipment.

The machine can be integrated with:

Reflow ovens
Automatic transfer systems
Loading equipment
Unloading equipment
Production conveyors

16. Automatic Product Detection

Sensors at the machine inlet and outlet provide:

Product detection
Input/output tracking
Product counting
Timeout detection
Production flow monitoring

17. Energy-Saving Mode

An energy-saving mode is provided to reduce energy consumption during standby or low-production conditions.

18. Safety Protection

The FC960 incorporates multiple safety functions:

Power phase-loss protection
Phase-sequence protection
Electrical overload protection
Liquid-level protection
Over-temperature protection
Leakage detection
Emergency stop protection

Emergency stop buttons are installed at the inlet, outlet, operator panel and electrical cabinet.

The machine body-to-ground resistance is <1 Ω, while machine surface voltage is <50 V.

Optional Functions

Cleaning Liquid Concentration Monitoring & Compensation

An optional real-time cleaning liquid concentration detection and compensation system can be configured to help maintain stable cleaning chemistry concentration during continuous production.

QR Code Scanning

An optional QR code scanning system can be integrated for product identification and production traceability.

MES / SECS-GEM Connectivity

Optional MES or SECS/GEM software can be configured for:

Production data exchange
Equipment status monitoring
Process traceability
Recipe management
Factory automation
Semiconductor manufacturing integration

Basic Technical Specifications

Item	Specification
Model	FC960
Brand	ACTSPRAY
Maximum Product Size	W600 × T100 mm
Conveyor Mesh Width	600 mm
Conveyor Speed	0.05–1.5 m/min
Conveyor Height	920 ± 25 mm
Transfer Direction	Left to Right
Cleaning Liquid Temperature	RT–80°C
Pre-Rinse Water Temperature	RT–70°C
Rinse 1 Water Temperature	RT–65°C
Rinse 2 Water Temperature	RT–60°C
Rinse 3 Water Temperature	RT–50°C
Final Rinse Water Temperature	RT
Hot Air Drying Temperature	RT–100°C
Exhaust Air Volume	Approx. 48 m³/min
DI Water Supply	10–20 L/min
DI Water Temperature	≥50°C
DI Water Pressure	≥0.3 MPa
DI Water Resistivity	≥15 MΩ·cm
PCW Supply	100–120 L/min
PCW Temperature	≤15°C
PCW Pressure	≥0.3 MPa
CDA Supply	0.5–0.7 MPa
CDA Consumption	100–200 L/min
Total Power	270 kW
Power Supply	AC 380 V, 3 Phase, 50 Hz
Rated Current	380 A
Machine Dimensions	Approx. L10400 × W1850 × H1750 mm
Machine Weight	Approx. 4600 kg
Control System	Industrial PC + PLC
Operation Interface	Chinese / English
SMEMA Interface	Standard
MES / SECS-GEM	Optional
QR Code Scanner	Optional
Chemical Concentration Monitoring	Optional

RT = Room Temperature. Final machine dimensions are subject to the approved equipment layout. Actual process parameters may be optimized according to package design, flux type, cleaning chemistry and required cleanliness level. PCW=Process Cooling Water.

Why Choose the FC960?

The FC960 Advanced Packaging Inline Cleaning Machine is designed for manufacturers facing the increasingly demanding cleaning requirements of large-size and low-standoff semiconductor packages.

Its extended washing section, multi-stage spray system and adjustable spray configuration provide enhanced process capability for removing flux residues from difficult-to-access areas beneath FCBGA, FCCSP, SIP and 2.5D packages.

The combination of three-stage chemical washing , chemical isolation, four-stage DI water rinsing, air drying and two-stage hot air drying provides a complete automated cleaning process in one production system.

At the same time, real-time monitoring of spray pressure, temperature, DI water resistivity and other critical parameters supports stable and repeatable production.

With SMEMA connectivity and optional QR code, MES and SECS/GEM integration, FC960 can be incorporated into automated semiconductor packaging production lines and high-reliability electronics manufacturing environments.