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Semiconductor production relies on magazines, carriers, trays, and handling components to transport sensitive devices throughout manufacturing processes.Over time, these components accumulate flux residues, dust, particles, and organic contaminants that may affect product quality and production stability.ACTSPRAY provides automated magazine and carrier cleaning systems designed to maintain contamination control in semiconductor manufacturing environments.Applications include:Semiconductor Magazine CleaningCarrier Tray CleaningLeadframe Magazine CleaningThrough ultrasonic cleaning, spray rinsing, and hot air drying, ACTSPRAY helps manufacturers extend carrier lifetime and improve production cleanliness.
DC260 JEDEC Tray Inline Cleaning Machine for Semiconductor Tray Cleaning
JEDEC Tray Cleaning | DI Water Spray Wash | DI Water Rinse | Air Drying| Hot Air Drying | 600 mm Conveyor | SMEMA Integration | Optional MES
The DC260 provides an automated and repeatable cleaning solution for reusable JEDEC trays, combining DI water spray washing, DI water rinsing, filtered air blow drying and hot air drying in one inline machine.
Its 600 mm conveyor width accommodates large JEDEC trays, while adjustable conveyor speed and spray pressure allow the cleaning process to be optimized for different production requirements.
For automated semiconductor manufacturing lines, SMEMA connectivity enables integration with tray loaders, unloaders and conveyors. Optional MES connectivity provides an additional solution for factory-level production monitoring.
FC580 Carrier Inline Spray Cleaning Machine for Semiconductor Carriers
MC560 Magazine Inline Ultrasonic Cleaning System | Automatic Lead Frame Magazine Cleaner
The MC560 Magazine Inline Ultrasonic Cleaning System is specially designed for automatic cleaning of leadframe magazines (carrier magazines) used in semiconductor packaging and electronics manufacturing.
The system adopts a combination of immersion ultrasonic cleaning, DI water rinsing, and hot air drying technology to effectively remove contaminants such as dust, particles, oil residues, and process residues from magazine surfaces.
With a fully automated loading and unloading design, the MC560 helps manufacturers improve cleaning consistency, reduce manual handling, and maintain high cleanliness standards for advanced semiconductor packaging processes.
