actspray

Remove Every Fux with Advanced Spray Cleaning Technology

Precision cleaning solutions for PCB assembly, SMT manufacturing, and semiconductor packaging

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About Our Business

Our Core Business Division

ACTSPRAY takes technological innovation as the driving force to provide advanced cleaning equipment for SMT, PCBA, and semiconductor package applications, delivering superior performance, high production efficiency, and cost‑effectiveness for customers and the market—unlocking new possibilities for next‑generation electronics manufacturing.

About us
Who We Are

ACTSPRAY CLEAN

ACTSPRAY delivering the most stable performance cleaning equipment across a wide range of industries: electronics, semiconductor, automotive, medical devices, aerospace, AI / Server (CPO) and more.Headquartered in Dongguan, China and certified to ISO9001, features a decade-experienced R&D team for fast custom orders and dependable delivery, paired with full-lifecycle technical support and after-sales service for semiconductor & PCB assembly cleaning applications.
What We Sell

Featured Products

We offer a range of standard & customized cleaning equipment for PCB, SMT & Semiconductor industries to fully meet varied production needs.

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Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal AC530

The AC530 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
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FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine
FC610 BGA Inline Aqueous Cleaning Machine for Solder Ball Mount Flux Removal

BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine FC610

The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning. It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
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BC210 coating pallet cleaner
BC210 Fixture Cleaning Machine for wave soldering fixtures and reflow oven condensers

Coating Pallet Fixture Cleaning Machine for SMT Production Line Maintenance BC210

BC210 Coating Pallet Cleaning Machine for wave soldering fixtures, reflow oven condensers, claws, chains and PCBA tooling. Water‑based chemcial liquid cleaning, full‑coverage spray, tape water or DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
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DI1000 DI Water Generator

DI1000 DI Water Generator Automatic Deionized Water Supply Machine for Cleaning Production

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DI-1000 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
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BC320 Stencil Electric Cleaner SMT

Electric SMT Stencil Cleaner Automatic Solder Paste Stencil Cleaning Machine BC320

The BC320 electric SMT stencil cleaning machine uses a three‑stage process—spray cleaning, DI water rinsing, and hot‑air drying—to clean solder paste stencils, red glue stencils, and misprinted PCBs with high precision. Fully automated, water‑based, and built with SUS304 stainless steel.
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FC760S substrate inline cleaning machine

IC Substrate Inline Cleaning Machine for Semiconductor Packaging Flux Cleaning Equipment FC760S

The FC760S  is a substrate inline cleaning machine designed for cleaning advanced packaging substrates, it adopting PC+PLC control system and stainless steel mesh conveyor, and dual-side spray washing/rinsing to remove flux residues efficiently. 

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FC820 SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner
Advanced packaging cleaning machine for fcBGA SiP and chiplet semiconductor manufacturing

SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner FC820

FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs. As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures. Typical cleaning challenges include: - Flux trapped under ultra-low standoff gap; - Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages; - Ionic contamination affecting reliability; - Cleaning consistency in high-volume inline production. The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.
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SMT Squeegee Auto Cleaning Machine Solder Paste Squeegee Blade Cleaner BC410

The BC410 Squeegee Cleaning Machine features an integrated ultrasonic and spray cleaning system. It follows a standard three-step workflow: washing with water-based solder paste cleaning fluid, rinsing with DI water, and hot air drying. Each batch can clean 6 to 12 squeegees efficiently. During operation, the squeegees are securely mounted on a special synchronous rotating fixture. This rotating design ensures thorough cleaning of all surfaces, including squeegee gaps, fixture contact areas, and both ends, achieving dead-angle-free cleaning. The result is complete removal of solder paste residues, restoring the squeegees' accuracy for immediate reuse in production.
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Our Strengths

Why Choose us?

Cleanliness is critical to semiconductor reliability and advanced electronic manufacturing. ACTSPRAY delivers high-performance cleaning solutions designed for today’s complex packaging technologies and precision assemblies.

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Advanced Cleaning Technology

We supply high-performance inline cleaning and drying systems to deliver exceptional cleaning results, stable running processes and consistent production quality. Our customized precision cleaning equipment are tailored for PCB assembly and advanced semiconductor packaging scenarios, covering SiP, Flip Chip, FCBGA, FCCSP, 2.5D/3D chips, low-standoff components, etc.

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Custom Solution

We provide both standard cleaning equipment and fully customized cleaning solutions to meet a wide range of production requirements. Our factory is ISO 9001 certified, and most equipment complies with CE standards, ensuring consistent quality, safety, and reliability for global industrial applications.

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Rich Experience & Global Service

We have extensive industry experience and provide comprehensive global after-sales support across the full product lifecycle, ensuring reliable service worldwide. Our professional team delivers rapid response, strong technical expertise, and end-to-end assistance, with established installed bases in India, Thailand, Vietnam, and the United States supported by local agents for timely on-site service.

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Blogs

The latest updates, technical guides, and industry trends on precision cleaning for PCB SMT and Semiconductor fields.

Get in Touch

We’re here to help and answer any question you might have. We look forward to hearing from you.