PCBA Cleaning Machine Manufacturer | Inline & Batch Flux Cleaning Equipment.
PCBA Cleaning Machine Manufacturer | Inline & Batch Flux Cleaning Equipment.

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FC760 Inline Cleaning Test: 100% Flux Removal from Low-Standoff LGA/BGA Assemblies

FC760 Inline Cleaning Test 100% Flux Removal from Low-Standoff LGA BGA Assemblies

1. Test Equipment and Conditions

ACTSPRAY conducted cleaning tests on two representative samples using the FC760 inline cleaning machine to evaluate the removal of water-soluble flux and contaminants under different process conditions.

  • Cleaning equipment: ACTSPRAY FC760 inline cleaning machine
  • Compressed air supply pressure: 0.5 MPa
  • Primary cleaning medium: Deionized (DI) water
  • DI water spray pressure: 4 kgf/cm²
  • Cleaning performance evaluation: Microscopic inspection for visible flux residues
  • Test samples: Sample 1# and Sample 2#

The test program included multiple conveyor speeds and a separate evaluation using NS308 neutral semi-aqueous cleaning agent.

2. DI Water Spray Cleaning Results

Sample 1#: Cleaning at Three Conveyor Speeds

Sample 1# was tested using DI water at a spray pressure of 4 kgf/cm², with the compressed air supply maintained at 0.5 MPa.

ParameterTest condition
Cleaning mediumDI water
Spray pressure4 kgf/cm²
Compressed air supply pressure0.5 MPa
Conveyor speeds30, 40, 50 cm/min
Inspection methodMicroscopic inspection
Result100% cleaning efficiency at all three settings
Observed flux residueNone detected by microscopic inspection

All three tested conveyor speeds achieved complete removal of the targeted water-soluble flux and contaminants, with no flux residues observed during microscopic inspection.

Sample 2#: Low-Standoff LGA Cleaning at a 35 µm Gap

Sample 2# featured an LGA component measuring 18.7 × 16.5 mm, with an approximately 35 µm gap beneath the component. This sample was evaluated using DI water spray cleaning at five conveyor speed settings.

ParameterTest condition
Component typeLGA
Component dimensions18.7 × 16.5 mm
Approximate standoff gap35 µm
Cleaning mediumDI water
Spray pressure4 kgf/cm²
Compressed air supply pressure0.5 MPa
Conveyor speeds10, 20, 30, 40, 50 cm/min
Inspection methodMicroscopic inspection
Result100% cleaning efficiency across all five settings
Observed flux residueNone detected, including beneath the LGA component

Microscopic inspection confirmed that no flux residues were observed on the sample surface or beneath the tested LGA component across all five conveyor speed settings.

These results demonstrate the FC760’s ability to remove the targeted water-soluble flux under the tested conditions, including beneath an LGA component with an approximately 35 µm standoff gap.

Test Result Summary

Across both samples, the FC760 achieved 100% cleaning efficiency under the specified DI water spray cleaning conditions, based on microscopic inspection.

  • Sample 1#: Three conveyor speeds tested — 30, 40, and 50 cm/min.
  • Sample 2#: Five conveyor speeds tested — 10, 20, 30, 40, and 50 cm/min.
  • Total: Eight DI water cleaning conditions evaluated, with no flux residues observed under microscopic inspection.

3. NS308 Neutral Semi-Aqueous Cleaning Agent Test

ACTSPRAY also evaluated NS308 neutral semi-aqueous cleaning agent on both samples.

ParameterTest condition
Cleaning agentNS308 neutral semi-aqueous cleaning agent
Concentration18%
Spray pressure3 kgf/cm²
Conveyor speed30 cm/min
SamplesSample 1# and Sample 2#
Inspection methodMicroscopic inspection
ResultNo flux residues observed on either sample

No flux residues were observed on either sample under the specified NS308 test conditions.

This provides an additional process option for applications where a cleaning agent is required. The final cleaning chemistry should be selected according to flux compatibility, assembly materials, rinsing requirements, drying performance, and the customer’s cleanliness criteria.

4. Process Adjustment for Mass Production

For mass-production applications, FC760 process parameters can be adjusted to accommodate different assembly designs, flux chemistries, cleanliness requirements, and throughput targets.

Adjustable parameters include:

  • Cleaning temperature: To suit the selected cleaning medium and flux chemistry.
  • Conveyor speed: To balance cleaning performance and production throughput.
  • Spray pressure: To achieve suitable spray action for the assembly.
  • Air knife pressure: To support water removal before subsequent drying or downstream processing.

The final production recipe should be validated using representative assemblies under actual operating conditions.

5. Conclusion

The FC760 inline cleaning machine was evaluated using two samples under multiple DI water spray cleaning conditions, followed by a separate NS308 semi-aqueous cleaning agent test.

For DI water cleaning, both samples achieved 100% cleaning efficiency across all eight tested conveyor speed conditions, based on microscopic inspection, with no flux residues observed. Sample 2# specifically demonstrated flux removal beneath an LGA component measuring 18.7 × 16.5 mm with an approximately 35 µm standoff gap.

The NS308 evaluation also showed no observed flux residues on either sample at an 18% concentration, 3 kgf/cm² spray pressure, and 30 cm/min conveyor speed.

These results provide a practical reference for evaluating inline PCBA cleaning processes involving water-soluble flux and low-standoff components. Actual production performance should be confirmed against the customer’s cleanliness and process validation requirements.

Need to evaluate your PCBA cleaning process?

Contact ACTSPRAY to discuss your assembly design, flux type, target throughput, and cleaning requirements. Our team can help evaluate suitable inline cleaning configurations and process parameters for your application.