FC960 SIP Inline Cleaning Machine for FCBGA FCCSP and 2.5D Advanced Packaging
FC960 Advanced Packaging Inline Cleaning Machine
High-Performance Inline Flux Cleaning System for Large-Size, Low-Standoff FCBGA, FCCSP and SIP Packages
FCBGA Cleaning | FCCSP Cleaning | SIP Cleaning | 2.5D Packaging | Low-Standoff Flux Removal | 3-Stage Chemical Washing | Multi-Stage DI Rinse | Hot Air Drying | SMEMA | MES / SECS-GEM
GC860 SIP Inline Zero Wastewater Cleaning Machine for Flux Cleaning
SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner FC820
FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs.
As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures.
Typical cleaning challenges include:
- Flux trapped under ultra-low standoff gap;
- Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages;
- Ionic contamination affecting reliability;
- Cleaning consistency in high-volume inline production.The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.
