AC530 Batch PCBA Cleaning Machine SMT Offline Cleaner for Small Volume PCB Assembly Laboratory Flux Residual Removal
The AC530 Offline PCB/PCBA Cleaning Machine is designed for small‑to‑medium batch SMT and THT assembly cleaning. It integrates chemical washing, multi‑stage DI water rinsing, and hot‑air drying into a single chamber, effectively removing rosin flux, no‑clean flux, and water‑soluble flux residues to meet IPC high‑cleanliness standards.
BC320 Electric SMT Stencil Cleaner Automatic Solder Paste Stencil Cleaning Machine
Coating Pallet Fixture Cleaning Machine for SMT Production Line Maintenance BC210
BC210 Coating Pallet Cleaning Machine for wave soldering fixtures, reflow oven condensers, claws, chains and PCBA tooling. Water‑based chemcial liquid cleaning, full‑coverage spray, tape water or DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.
DI200 DI Water Generator Automatic Deionized Water Purifier with RO System for PCBA Cleaning Production 200L/H
DI200 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine
The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning.It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.
FC760 Inline Deflux Cleaning Machine for Semiconductor Packaging & PCBA High Volume Production
The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.
GC860 Zero-Wastewater Inline Deflux Cleaning Machine for Advanced Modules and Semiconductor Packages
The GC860 is a zero-wastewater inline cleaning system designed for post-soldering flux removal from SiP modules, FCBGA packages, optical modules and other precision electronic products.SIP Flux Cleaning | Zero Rinse Wastewater | Closed-Loop Liquid Recovery | Condensation Recovery | Multi-Stage Spray Cleaning | Hot Air Drying | SMEMA | Optional MES
SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner FC820
FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs.
As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures.
Typical cleaning challenges include:
- Flux trapped under ultra-low standoff gap;
- Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages;
- Ionic contamination affecting reliability;
- Cleaning consistency in high-volume inline production.The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.
