DI1000 DI Water Generator Automatic Deionized Water Purifier with RO System for PCBA Cleaning Production 1000L/H

DI-1000 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.

DI200 DI Water Generator Automatic Deionized Water Purifier with RO System for PCBA Cleaning Production 200L/H

DI200  is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.

DI500 DI Water Generator Automatic Deionized Water Purifier with RO System for PCBA Cleaning Production 500L/H

DI500 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.

EDI1000 Industrial Ultra-Pure Water Generator System Electrodeionization EDI Water Automatic Purifier Equipment for PCBA and Semiconductor Cleaning Production 1000L/H

The EDI1000 EDI Water Machine is an advanced ultrapure water generation system designed for applications requiring high-quality process water.

With a designed production capacity of 1 m³/h, the system delivers stable ultrapure water with a resistivity of ≥15 MΩ·cm (25℃) through a combination of:

  • Pretreatment system
  • Double-pass RO system
  • EDI polishing system
  • Mixed bed resin polishing system
  • Intelligent control system

EDI5000 Industrial Ultra-Pure Water Generator System Electrodeionization EDI Water Automatic Purifier Equipment for PCBA and Semiconductor Cleaning Production 5000L/H

The EDI5000 EDI Water Machine is an advanced ultrapure water generation system designed for applications requiring high-quality process water.

With a designed production capacity of 5 tons/h, the system delivers stable ultrapure water with a resistivity of ≥15 MΩ·cm (25℃) through a combination of:

  • Pretreatment system
  • Double-pass RO system
  • EDI polishing system
  • Mixed bed resin polishing system
  • Intelligent control system

FC580 Carrier Inline Spray Cleaning Machine for Semiconductor Carriers

FC580 automatic carrier inline spray cleaning system for removing dust, particles and water-soluble flux residues from semiconductor carriers. DI water rinsing and hot-air drying.

FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine

The FC610 Inline Cleaning System is an automated solution engineered specifically for the removal of water‑soluble flux residues after the BGA solder ball mounting process. Designed for high‑reliability semiconductor packaging, the FC610 has double layer kevlay mesh to ensures consistent, stable and thorough cleaning.It utilizes a sophisticated four-stage process consisting of heated DI water cleaning, DI water rinsing, hot air-knife air drying. This comprehensive workflow effectively removes flux residues from both the BGA package and the carrier plate, ensuring a thoroughly clean and dry surface.

FC660 Flip Chip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.

FC700 FlipChip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.

FC720 Inline PCBA & Flip Chip Cleaning Machine | Automatic Inline Flux Cleaning for PCBA, SiP & Low-Gap Flip Chip Packages

FC720 is a new-generation inline spray cleaning machine independently designed and manufactured by ACTSPRAY for automatic flux residue removal from PCBA assemblies, SiP modules and low-gap flip chip packages.

The system combines multi-stage chemical spray cleaning, chemical isolation, multi-stage DI water rinsing, air knife and hot air drying in one continuous inline process. Special spray nozzle combinations and adjustable upper/lower spray systems help cleaning liquids penetrate narrow gaps and remove flux residues from densely populated PCBA assemblies and low-standoff semiconductor packages.

With a 600 mm-wide stainless steel mesh conveyor, adjustable conveyor speed and fully monitored cleaning parameters, FC720 provides a stable and repeatable cleaning process for automated electronics and semiconductor packaging production lines.

Key Applications: PCBA Cleaning | SiP Cleaning | Flip Chip Cleaning | FCBGA Cleaning | FCCSP Cleaning | Low-Gap Package Cleaning | Flux Residue Removal

FC730 Inline Cleaning Machine for FCBGA Semiconductor Packaging Flux Removal Automatic PCB Cleaner

FC730 is FCBGA or SIP flux auto cleaning system, engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC730 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

FC760 Inline Deflux Cleaning Machine for Semiconductor Packaging & PCBA High Volume Production

The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.