AC620 is a high-performance Batch PCBA Cleaning Machine features vertical spray cleaning. The spray manifolds and air knives are fixed, while PCBA travels back and forth with fixtures (the most stable structure in pcb cleaning field), it can effectively remove flux from PCBs with fine-pitch and flip-chip components. AC620 fitted with dual tracks and two complete cleaning zones on both sides. Each zone is equipped with 4 high-pressure spray manifolds and 4 professional drying air knives. Two rows of SIP/PCBA can be processed at the same time, doubling the production capacity.
AC630 is a high-performance Batch PCBA Cleaning Machine features vertical spray cleaning. The spray bars and air knives are fixed, while PCBA travels back and forth with fixtures (the most stable structure in pcb cleaning field), it can effectively remove flux from PCBs with fine-pitch and flip-chip components. AC620 fitted with dual tracks and two complete cleaning zones on both sides. Each zone is equipped with 4 high-pressure spray bars and 4 professional drying air knives. Two rows of SIP/PCBA can be processed at the same time, doubling the production capacity.
The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.
FC730 is FCBGA or SIP flux auto cleaning system, engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC730 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.
The SC720 IGBT Inline Ultrasonic Cleaning Machine is specially designed for automated cleaning of IGBT modules, IPM (Intelligent Power Modules), and leadframe-based semiconductor packages.
Using a combination of multi-stage ultrasonic cleaning, spray cleaning, and DI water rinsing technology, the system effectively removes flux residues, organic contaminants, and process residues generated during semiconductor packaging processes.
With a fully automated loading and unloading system, SC720 provides a reliable cleaning solution for high-volume semiconductor manufacturing, improving product cleanliness, reliability, and production efficiency.
The MC560 Magazine Inline Ultrasonic Cleaning System is specially designed for automatic cleaning of leadframe magazines (carrier magazines) used in semiconductor packaging and electronics manufacturing.
The system adopts a combination of immersion ultrasonic cleaning, DI water rinsing, and hot air drying technology to effectively remove contaminants such as dust, particles, oil residues, and process residues from magazine surfaces.
With a fully automated loading and unloading design, the MC560 helps manufacturers improve cleaning consistency, reduce manual handling, and maintain high cleanliness standards for advanced semiconductor packaging processes.