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DC350 inline water washing machine for PCBA, IC trays and transfer trays. Uses DI water washing, multi-stage rinsing and hot-air drying to remove solder balls, dust and process debris.

DC350 Inline Water Washing Machine Automatic DI Water Washing System for PCBA and IC Trays

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DC350 inline water washing machine for PCBA, IC trays and transfer trays. Uses DI water washing, multi-stage rinsing and hot-air drying to remove solder balls, dust and process debris.
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DC760 SMT Magazine Inline Cleaning Machine | PCB Magazine Cleaner

DC760 SMT Magazine Inline Cleaning Machine PCB Magazine Cleaner

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DC760 SMT PCB Magazine Inline Cleaning Machine

SMT Magazine Cleaning | PCB Magazine Cleaning | Multi-Direction Spray Wash | DI Water Rinse | Air Drying | Dual-Stage Hot Air Drying | SMEMA | MES | Barcode Scanning
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DI200 DI Water Generator

DI-200 DI Water Generator ACTSPRAY Deionized Water Supply Machine for Cleaning Production

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DI200  is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
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DI1000 DI Water Generator

DI1000 DI Water Generator Automatic Deionized Water Supply Machine for Cleaning Production

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DI-1000 is used to turn tap water into DI water and supply to our PCBA batch type cleaning machine for DI water rinse after liquid cleaning. It consists of three main components: pre-treatment system, RO reverse osmosis system, and MB mixed bed system. The equipment features easy operation, stable performance, and fully automatic operation, ensuring high effluent resistivity.
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BC320 Stencil Electric Cleaner SMT

Electric SMT Stencil Cleaner Automatic Solder Paste Stencil Cleaning Machine BC320

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The BC320 electric SMT stencil cleaning machine uses a three‑stage process—spray cleaning, DI water rinsing, and hot‑air drying—to clean solder paste stencils, red glue stencils, and misprinted PCBs with high precision. Fully automated, water‑based, and built with SUS304 stainless steel.
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Explosion-Proof Solvent Recovery Machine, Industrial Distillation Solvent Recycler

Explosion-Proof Solvent Recovery Machine ACTSPRAY Industrial Distillation Solvent Recycler T-40

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Our Solvent Distillation Recyclers is designed for both Automotive and Industrial applications. Our goal is to reduce hazardous waste with solvent recovery using distillation recyclers consequently cutting costs on solvent purchases.
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FC580 automatic carrier inline spray cleaning system for removing dust, particles and water-soluble flux residues from semiconductor carriers. DI water rinsing and hot-air drying.
FC580 automatic carrier inline spray cleaning system for removing dust, particles and water-soluble flux residues from semiconductor carriers. DI water rinsing and hot-air drying.

FC580 Carrier Inline Spray Cleaning Machine for Semiconductor Carriers

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FC580 automatic carrier inline spray cleaning system for removing dust, particles and water-soluble flux residues from semiconductor carriers. DI water rinsing and hot-air drying.

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FC660 Inline Flip Chip semiconductor Cleaner

FC660 Flip Chip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

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FC660 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC660 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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FC700 Inline FlipChip Semiconductor Cleaner

FC700 FlipChip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner

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FC700 is a high-performance Inline Semiconductor Package Cleaning Machine designed specifically for advanced packaging applications including CSP, WLP, PLP, SiP, and FC devices. It is primarily used for the efficient removal of post-soldering flux residues. It's a PC-based control system and a mesh belt conveyor system, the FC700 utilizes top-and-bottom spray cleaning combined with multi-stage rinsing. As a new-generation, high-precision inline cleaning system, it ensures superior cleaning results and high stability during continuous production.
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FC760 pcba inline cleaning machine
spertar-advanced semiconductor cleaning solution provider

FC760 Inline PCBA Cleaning Machine for Flux Residue Removal in High Volume SMT Production

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The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.

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FC800-C PLP Inline Cleaning System PLP Panel Flux Cleaning Machine
FC800-C PLP inline cleaning system for automated flux residue removal from PLP panels and SIP modules. Multi-stage spray cleaning, DI water rinsing and hot-air drying.

FC800-C PLP Inline Cleaning Machine for Flux Residue Removal

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PLP Cleaning Machine | Panel Level Packaging Cleaning Machine | Semiconductor Packaging Cleaning Machine | Flux Residue Removal Machine

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FC800 Inline Cleaning System for Semiconductor FCBGA, FCCSP & 2.5D3D Packaging Automatic PCB Cleaner
spertar-advanced semiconductor cleaning solution provider

FlipChip Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging Automatic PCB Cleaner FC800

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The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.

Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.

With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.

The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.

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