IC Substrate Inline Cleaning Machine for Semiconductor Packaging Flux Cleaning Equipment FC760S

The FC760S  is a substrate inline cleaning machine designed for cleaning advanced packaging substrates, it adopting PC+PLC control system and stainless steel mesh conveyor, and dual-side spray washing/rinsing to remove flux residues efficiently. 

LTV-500 Low Temperature Wastewater Evaporator Heat Pump Vacuum Evaporation System

The LTV-500 Low Temperature Wastewater Evaporator is a high-efficiency energy-saving vacuum evaporation wastewater treatment equipment independently developed based on advanced heat pump vacuum evaporation technology. It is widely applied in industrial wastewater concentration and purification scenarios, especially suitable for treating cleaning wastewater containing flux, cleaning agent and oil impurities such as PCBA rinsing water and fixture cleaning wastewater. It can process 500 liters/day of wastewater in 24 hours.

MC560 Magazine Inline Ultrasonic Cleaning System | Automatic Lead Frame Magazine Cleaner

The MC560 Magazine Inline Ultrasonic Cleaning System is specially designed for automatic cleaning of leadframe magazines (carrier magazines) used in semiconductor packaging and electronics manufacturing.

The system adopts a combination of immersion ultrasonic cleaning, DI water rinsing, and hot air drying technology to effectively remove contaminants such as dust, particles, oil residues, and process residues from magazine surfaces.

With a fully automated loading and unloading design, the MC560 helps manufacturers improve cleaning consistency, reduce manual handling, and maintain high cleanliness standards for advanced semiconductor packaging processes.

PCBA Batch Cleaning Machine for Circuit Board Assembly SIP Electronic Cleaning Equipment AC630

AC630 is a high-performance Batch PCBA Cleaning Machine features vertical spray cleaning. The spray bars and air knives are fixed, while PCBA travels back and forth with fixtures (the most stable structure in pcb cleaning field), it can effectively remove flux from PCBs with fine-pitch and flip-chip components. AC620 fitted with dual tracks and two complete cleaning zones on both sides. Each zone is equipped with 4 high-pressure spray bars and 4 professional drying air knives. Two rows of SIP/PCBA can be processed at the same time, doubling the production capacity.

Reflow Oven Condenser Chiller Cleaning Machine for SMT Production Line Maintenance BC220

BC210 Pallet Cleaning Machine for wave soldering pallet, reflow oven condensers chiller, claws, chains, filters and PCBA tooling. PLC control, water‑based chemcial liquid cleaning, full‑coverage spray, tape water / DI water rinse and hot‑air drying in one chamber. High efficiency, safe operation and long service life.

SC720 IGBT Inline Ultrasonic Cleaning Machine | Lead Frame Flux Cleaning Equipment

The SC720 IGBT Inline Ultrasonic Cleaning Machine is specially designed for automated cleaning of IGBT modules, IPM (Intelligent Power Modules), and leadframe-based semiconductor packages.

Using a combination of multi-stage ultrasonic cleaning, spray cleaning, and DI water rinsing technology, the system effectively removes flux residues, organic contaminants, and process residues generated during semiconductor packaging processes.

With a fully automated loading and unloading system, SC720 provides a reliable cleaning solution for high-volume semiconductor manufacturing, improving product cleanliness, reliability, and production efficiency.

SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner FC820

FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs. As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures. Typical cleaning challenges include: - Flux trapped under ultra-low standoff gap; - Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages; - Ionic contamination affecting reliability; - Cleaning consistency in high-volume inline production.The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.

T-40 Explosion-Proof Solvent Recovery Machine Industrial Distillation Solvent Recycler Wastewater Evaporator

Our Solvent Distillation Recyclers is designed for both Automotive and Industrial applications. Our goal is to reduce hazardous waste with solvent recovery using distillation recyclers consequently cutting costs on solvent purchases.

UC-250BV SMT PCB Surface Cleaning Machine Inline Bare PCB Dust & Static Removal System

UC-250BV removes dust, fibers, and metal particles from PCB pads inline before printing. It guarantees a contaminant-free surface to eliminate soldering defects and maximize yield.

UC-250M-CV SMT PCB Surface Cleaning Machine Inline Bare PCB Dust & Static Removal System

UC-250M-C integrates two distinct cleaning mechanisms: "Rotary Brush + Vacuum" and "Sticky Roller + Tack Roll." The system offers flexible operation modes, allowing both functions to run simultaneously or independently based on specific process requirements. Brush Cleaning System: Effectively removes particulates and larger foreign debris from the PCB surface. Roller Cleaning System: Targets micro-dust and electrostatically adsorbed particles for deep cleaning.