DI1000 DI Water Generator Automatic Deionized Water Purifier with RO System for PCBA Cleaning Production 1000L/H
DI200 DI Water Generator Automatic Deionized Water Purifier with RO System for PCBA Cleaning Production 200L/H
DI500 DI Water Generator Automatic Deionized Water Purifier with RO System for PCBA Cleaning Production 500L/H
EDI5000 Industrial Ultra-Pure Water Generator System Electrodeionization EDI Water Automatic Purifier Equipment for PCBA and Semiconductor Cleaning Production 5000L/H
The EDI5000 EDI Water Machine is an advanced ultrapure water generation system designed for applications requiring high-quality process water.
With a designed production capacity of 5 tons/h, the system delivers stable ultrapure water with a resistivity of ≥15 MΩ·cm (25℃) through a combination of:
- Pretreatment system
- Double-pass RO system
- EDI polishing system
- Mixed bed resin polishing system
- Intelligent control system
FC580 Carrier Inline Spray Cleaning Machine for Semiconductor Carriers
FC610 BGA Ball Mount Flux Cleaning Equipment In-line Aqueous Cleaning Machine
FC660 Flip Chip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner
FC700 FlipChip Inline Cleaning Machine Semiconductor Cleaning System PCBA Cleaner
FC760 Inline Deflux Cleaning Machine for Semiconductor Packaging & PCBA High Volume Production
The FC760 Inline Cleaning System is engineered for high‑precision flux removal in FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) module manufacturing. As advanced packaging technologies continue to shrink component gaps and increase I/O density, the FC760 delivers the cleaning performance required to maintain high yield and reliability in modern semiconductor packaging assembly lines.
FC800-C PLP Inline Cleaning Machine for Flux Residue Removal
FlipChip Inline Cleaning System for FCBGA, FCCSP & 2.5D/3D Packaging Automatic PCB Cleaner FC800
The FC800 is a high-performance semiconductor inline cleaning equipment designed for advanced packaging deflux processes, including FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package), and 2.5D/3D IC technologies.
Engineered to address the challenges of ultra-low standoff components and high-density packaging, the FC800 delivers precise and reliable removal of flux residues from complex assemblies. Its advanced spray system and optimized nozzle configuration ensure effective cleaning under fine-pitch devices and narrow gaps.
With intelligent PC+PLC control and a Windows-based operation interface, the system offers stable, automated, and user-friendly performance in high-volume production environments.
The integrated chemical management system, including real-time monitoring, auto compensation, and vapor recovery, significantly reduces operational costs while maintaining consistent cleaning quality.
