PCBA Cleaning Machine Manufacturer | Inline & Batch Flux Cleaning Equipment.
PCBA Cleaning Machine Manufacturer | Inline & Batch Flux Cleaning Equipment.

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ACTSPRAY BC610 vs Leading Aqueous PCB Cleaning Systems: A High-Performance Alternative for PCBA Cleaning

bc610 pcba inline cleaning machine for large batches pcba cleaning to remove flux residue

ACTSPRAY BC610 vs Leading Aqueous PCB Cleaning Systems AS100: A High-Performance Alternative for PCBA Cleaning.?

ACTSPRAY BC610 has several advantages, especially for advanced PCBA flux cleaning and semiconductor package de-flux applications. Below is a professional comparison:

1. Stronger Machine Structure & Longer Lifetime

ItemACTSPRAY BC610Others (AS100)Advantage
Main machine constructionStainless steelPolypropylene✅ ACTSPRAY

Why it matters:

ACTSPRAY BC610 uses a stainless-steel machine body, providing:

  • Higher mechanical strength
  • Better resistance to chemical corrosion
  • Better thermal stability under high-temperature cleaning processes
  • Longer service life in demanding semiconductor and electronics factories

Others AS100 uses polypropylene for the main structure, which is lighter but has lower rigidity and long-term durability compared with stainless steel.


2. Higher Cleaning Capacity for Large and Heavy PCBs

ItemACTSPRAY BC610Others AS100
Transport width600mm508mm (610mm option)
Max PCB weight4.5kg standard0.45kg standard (4.5kg option)
Machine sizeL6100xW1750xH1700 (mm)L4900xW1500xH1300 (mm)

ACTSPRAY‘s advantage:

BC610 is designed for modern high-density PCB assemblies:

  • Large-size PCB
  • Heavy automotive electronics boards
  • Power electronics
  • Semiconductor package substrates

AS100 requires an option upgrade to reach similar loading capability.


3. Higher Temperature Cleaning Performance

ProcessACTSPRAY BC610AS100
Drying temperatureRT~100℃ / 149℃ standardRT~82℃ (149℃ option)

Why ACTSPRAY performs better:

Higher temperature capability improves:

  • Flux residue dissolution
  • Cleaning efficiency for lead-free solder flux
  • Drying performance
  • Reduction of ionic contamination

Especially for Semiconductor advanced packages:

  • PLP
  • Sip
  • LGA
  • Flip Chip
  • FCBGA

4. More Complete Cleaning Process Configuration

ACTSPRAY BC610 Process:

Pre-wash → Wash → Chemical Isolation → Pre-rinse → Rinse → Final Rinse → Air Blow → Hot Air Dry 1 → Hot Air Dry 2

AS100:

Pre-wash → Wash → Chemical Isolation (optional) → Rinse → Final Rinse → Air Blow → Drying

ACTSPRAY advantages:

✅ Standard chemical isolation module
✅ Additional pre-rinse process
✅ Better chemical separation
✅ Lower risk of cross contamination

This is especially important when cleaning:

  • Water-soluble flux
  • No-clean flux residue
  • Semiconductor packaging residue

5. More Powerful Washing & Rinsing System

Washing Module

ItemACTSPRAY BC610AS100
Upper spray manifold65
Lower spray manifold65
Pump10HP10HP

ACTSPRAY provides:

6 upper + 6 lower spray manifolds

Compared with:

5 upper + 5 lower spray manifolds

Benefits:

  • More uniform spray coverage
  • Better cleaning under components
  • Higher cleaning consistency

Rinse Performance

ItemACTSPRAY BC610Others AS100
Rinse spray4 upper + 4 lower3 upper + 3 lower
Pump power7.5HP2HP

ACTSPRAY provides:

  • Higher rinse flow
  • Stronger contamination removal
  • Better DI water cleaning performance

Critical for semiconductor packaging where ionic residue must be minimized.


6. Better Flux Isolation & Chemical Control

Chemical Isolation Module

ACTSPRAY BC610:

✅ Standard configuration

  • 2 upper air knives
  • 1 lower air knife
  • 10HP blower

Others AS100:

Optional configuration

  • 1 upper air knife
  • 1 lower air knife
  • 10HP blower

Advantages:

ACTSPRAY reduces:

  • Chemical carry-over
  • Cross contamination between tanks
  • DI water contamination

Improving:

  • Cleaning stability
  • Chemical consumption
  • Process repeatability

7. Better Filtration System

ItemACTSPRAY BC610Others AS100
Wash filter barrelStandard inside machineOptional outside

ACTSPRAY’s advantage:

Integrated filtration provides:

  • Easier maintenance
  • Better particle control
  • More stable cleaning performance

Important for:

  • Fine pitch PCB
  • Semiconductor substrate cleaning
  • High reliability electronics

8. Stronger Drying Capability

ItemACTSPRAY BC610Others AS100
Air blow2 × 7.5HP blower1 × 7.5HP blower
Dryer100℃/149℃ IR standard82℃ standard

ACTSPRAY provides:

  • Double air blow power
  • Higher drying temperature
  • Better moisture removal

Benefits:

  • Prevent water marks
  • Improve final cleanliness
  • Reduce corrosion risks

9. Lower Operating Cost

Liquid Condensation System

ACTSPRAY:

✅ Long cross condensation device ×2
✅ Can save up to 50% liquid consumption

Others:

Short condensation design

Result:

ACTSPRAY can reduce:

  • Chemical loss
  • Water consumption
  • Operating cost

10. More Complete Safety Protection

ACTSPRAY standard features:

✅ Liquid/water leak detection alarm
✅ Air vent regulator
✅ Multiple protection systems

Others:

Some functions require options.

Advantages:

  • Safer operation
  • Less downtime
  • Better factory compliance

11. Faster Delivery

ItemACTSPRAY BC610Others AS100
Delivery time2-2.5 months3–4 months

ACTSPRAY provides:

  • Faster project deployment
  • Shorter production waiting time
  • Better response for urgent production expansion

Overall Evaluation

CategoryWinner
Machine durability✅ ACTSPRAY
PCB loading capability✅ ACTSPRAY
Cleaning temperature✅ ACTSPRAY
Cleaning process completeness✅ ACTSPRAY
Spray coverage✅ ACTSPRAY
Rinse performance✅ ACTSPRAY
Drying performance✅ ACTSPRAY
Chemical control✅ ACTSPRAY
Operating cost✅ ACTSPRAY
Delivery time✅ ACTSPRAY

Compared with Others AS100, ACTSPRAY BC610 provides a more complete and powerful cleaning solution with stainless-steel construction, higher temperature capability, stronger washing/rinsing performance, standard chemical isolation, advanced drying technology, and lower operating cost. It is specifically designed for high-reliability PCBA and semiconductor package cleaning applications where cleanliness, stability, and process control are critical.