Advanced semiconductor packaging technologies such as Flip Chip, FCBGA, FCCSP, SiP, and 2.5D/3D packaging enable higher performance and greater integration. However, increasing package complexity creates significant cleaning challenges during manufacturing.
During soldering and assembly processes, flux residues and organic contaminants can remain trapped beneath low standoff components, fine-pitch bumps, and high-density interconnections. These residues may lead to electrical leakage, corrosion, and reliability failures.
ACTSPRAY provides advanced packaging cleaning equipment engineered for precise flux residue removal from complex semiconductor packages.
Our solutions support:
▪ Flip Chip Cleaning
▪ FCBGA / FCCSP Cleaning
▪ SiP Module Cleaning
▪ BGA Cleaning
▪ Substrate Cleaning
With controlled spray cleaning, DI water rinsing, and advanced drying technologies, ACTSPRAY helps semiconductor manufacturers achieve high cleanliness standards while maintaining production efficiency.
Need Help Optimizing Your Cleaning Process?
Every manufacturing process has unique contamination challenges. ACTSPRAY engineers provide professional cleaning solutions based on your product requirements, cleanliness standards, and production conditions.
