The FC580 Carrier Inline Spray Cleaning System is designed for the automatic cleaning of dust, particles and water-soluble flux residues from semiconductor carriers.
The system uses a continuous stainless steel mesh conveyor and multi-stage spray washing to provide consistent cleaning across the carrier surface. Adjustable upper and lower spray bars allow the washing pressure and spray angle to be matched to different carrier structures and washing requirements.
After washing process, the carriers pass through multiple DI water rinsing stages to remove remaining contaminants and cleaning residues. Air dry removes surface water before the carriers enter the hot-air drying section, providing a dry surface for the next production process.
The FC580 is controlled by a PC + PLC system with Windows-based bilingual operating software. Sensors at the machine inlet and outlet provide carrier detection and counting, while the SMEMA interface allows the cleaner to communicate with upstream and downstream equipment.
The machine is constructed from stainless steel for long-term industrial operation and incorporates leakage detection, liquid-level protection, heating over-temperature protection and electrical overload protection. An optional SECS/GEM system is available for equipment status monitoring and production-line integration.
Cleaning Process
Loading → Washing→ Pre-Rinsing → Rinsing → Final Rinsing → Air Drying→ Hot-Air Drying → Unloading
Key Features
Designed for Semiconductor Carrier Cleaning
The FC580 is developed for automated removal of dust particles, contaminants and water-soluble flux residues from semiconductor carriers.
Multi-Stage Spray Washing
The washing section uses adjustable upper and lower spray bars. Spray pressure and spray angle can be adjusted according to carrier structure and process requirements.
Complete DI Water Rinsing
Pre-rinsing, rinsing and final rinsing stages progressively remove washing residues and contaminants from the carrier surface.
Adjustable Air Drying
Air drying pressure, height and angle can be adjusted to improve water removal before the drying section.
Hot-Air Drying
The hot-air drying section provides controlled drying after the final rinse. A double-layer structure helps reduce external surface temperature during operation.
DI Water Resistivity Monitoring
Real-time DI water resistivity monitoring helps maintain consistent rinsing conditions and provides process control for high-cleanliness applications.
Stainless Steel Construction
The machine is manufactured with stainless steel components for resistance to cleaning chemicals and long-term industrial use. The design service life is up to 20 years under appropriate operating conditions.
PC + PLC Control
A PC + PLC control architecture provides centralized management of the washing, rinsing, drying, conveyor and safety functions. Windows-based bilingual operating software simplifies daily operation and process setup.
Automatic Carrier Detection and Counting
Sensors at the loading and unloading ends detect carrier movement and provide counting and monitoring functions during production.
SMEMA Interface
The FC580 can communicate with upstream and downstream equipment through a SMEMA signal interface for inline production integration.
Leakage Protection
The washing and rinsing sections use a double-layer leakage protection structure. The drying section also features double-layer protection to improve equipment safety.
Automatic Protection Functions
The system includes electrical overcurrent and overload protection, heating over-temperature protection, and high/low water-level protection.
Optional SECS/GEM Integration
An optional SECS/GEM software package can be configured for equipment status monitoring and communication with factory production systems.
Applications
The FC580 is suitable for automated cleaning applications in:
- Semiconductor carrier cleaning
- Semiconductor packaging
- IC packaging processes
- Carrier dust and particle removal
- Water-soluble flux residue removal
- Semiconductor production lines
- Automated carrier cleaning processes
Specifications
| Parameter | FC580 |
|---|---|
| Equipment Type | Carrier Inline Spray Cleaning Machine |
| Model | FC580 |
| Main Application | Semiconductor Carrier Cleaning |
| Washing Target | Dust, Particles, Water-Soluble Flux Residues |
| Washing Method | Multi-Stage Spray Washing |
| Spray Configuration | Upper & Lower Spray Bars |
| Spray Pressure | Adjustable |
| Spray Angle | Adjustable |
| Rinsing Process | Pre-Rinsing + Rinsing + Final Rinsing |
| Rinsing Medium | DI Water |
| DI Water Monitoring | Resistivity Monitoring |
| Water Removal | Air Drying |
| Air Drying Adjustment | Pressure / Height / Angle |
| Drying Method | Hot-Air Drying |
| Conveyor | Stainless Steel Mesh Conveyor |
| Control System | PC + PLC |
| Operating Software | Windows-Based Bilingual Software |
| Carrier Detection | Inlet & Outlet Sensors |
| Carrier Counting | Automatic |
| Production Interface | SMEMA |
| Machine Construction | Stainless Steel |
| Leakage Protection | Double-Layer Protection |
| Drying Section Protection | Double-Layer Structure |
| Water Level Protection | High / Low Level Protection |
| Heating Protection | Over-Temperature Protection |
| Electrical Protection | Overcurrent / Overload Protection |
| SECS/GEM | Optional |
