IC Substrate Inline Cleaning Machine for Semiconductor Packaging Flux Cleaning Equipment FC760S
MC560 Magazine Inline Ultrasonic Cleaning System | Automatic Lead Frame Magazine Cleaner
The MC560 Magazine Inline Ultrasonic Cleaning System is specially designed for automatic cleaning of leadframe magazines (carrier magazines) used in semiconductor packaging and electronics manufacturing.
The system adopts a combination of immersion ultrasonic cleaning, DI water rinsing, and hot air drying technology to effectively remove contaminants such as dust, particles, oil residues, and process residues from magazine surfaces.
With a fully automated loading and unloading design, the MC560 helps manufacturers improve cleaning consistency, reduce manual handling, and maintain high cleanliness standards for advanced semiconductor packaging processes.
SiP Inline Cleaning Machine for Semiconductor Packaging Automatic PCB Cleaner FC820
FC820 is an automatic aqueous cleaning machine dedicated to remove flux from large-size and low-standoff gap SiP packaging modules and high-capacity PCBAs.
As semiconductor packages continue evolving toward lower standoff heights, and higher I/O density, traditional cleaning methods struggle to remove flux residues beneath complex package structures.
Typical cleaning challenges include:
- Flux trapped under ultra-low standoff gap;
- Incomplete cleaning under FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and 2.5D/3D packages;
- Ionic contamination affecting reliability;
- Cleaning consistency in high-volume inline production.The FC820 inline cleaning euipment is specifically engineered to solve these advanced packaging cleaning challenges.
