Why semiconductor cleaning is critical?
Advanced chip packaging technologies such as SiP (System in Package), FCBGA (Flip Chip Ball Grid Array), PoP (Package on Package) and 2.5D/3D Packaging are driving high-performance computing development, yet they also bring severe flux residue cleaning challenges. Larger dies, more solder bumps and ultra-low standoff heights greatly complicate post-reflow flux removal. With standoff heights decreasing to less than 50μ, outgassing during reflow diminishes, further complicating fux residue removal. Components such as QFNs (Quad Flat No-leads) and LGAs (Land Grid Array) with large thermal pads add to these challenges, risking reliability issues including electrochemical migration and electrical leakage.
Key Features of FC730 In-line Cleaning Machine
1. Intelligent PC+PLC Control System
Equipped with mature PC+PLC dual control system and independent Windows-based English operation interface, the FC730 flux inline cleaning machine supports stable and convenient parameter setting, equipment operation and data query, adapting to overseas factory production operation habits.
2. Ultra-Long Adjustable Chemical Washing Section
Designed with a super-long chemical wash chamber to ensure sufficient flux removal reaction time for FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) modules. The chemical spray pressure and spray angle are fully adjustable, realizing targeted cleaning for different flux residues.
3. Custom Combined Nozzle Kits for Low-Gap Modules
Matched with professional combined spray nozzle kits, specially optimized for low-gap FCBGA (Flip Chip Ball Grid Array), FCCSP (Flip Chip Chip Scale Package) and SiP (System in Package) modular products. It solves the cleaning difficulty of residual flux in narrow gaps and improves the uniformity and cleanliness of inline cleaning.
4. Adjustable Chemical Isolation & Air Blow System
Independent chemical isolation section effectively avoids cross-contamination between processes. The air blow section supports free adjustment of air pressure and blowing angle, which can quickly remove residual chemical liquid on the surface and gaps of workpieces to prepare for subsequent rinsing.
5. Automatic Chemical Adding & Draining Device
Built-in intelligent chemical auto supply and waste liquid drainage system, realizing unmanned automatic liquid replenishment and regular drainage. It reduces manual operation errors, maintains stable chemical liquid environment, and improves continuous production efficiency.
6. Chemical Vapor Cooling & Recovery System
Equipped with professional vapor cooling and recovery structure, which effectively recycles volatilized chemical solvent, greatly reduces chemical consumption and production costs, and meets environmental protection production standards of semiconductor factories.
7. Independent Chemical Temperature Cooling System
The supporting chemical temperature cooling down system keeps the cleaning agent working within a constant temperature range, avoids cleaning quality fluctuation caused by temperature change, and ensures consistent flux cleaning effect in mass production.
8. Real-Time DI Water Inline Monitoring System
Integrated DI water resistivity and flow rate inline real-time monitoring module, which can track water quality and water volume data in real time. Once abnormal parameters occur, the system will prompt early warning to ensure high-standard rinsing quality.
9. Long-Distance Adjustable DI Water Rinsing Section
Adopts extended long rinse section design to thoroughly wash residual chemical and flux residues on the surface of semiconductor modules. The DI water spray pressure and angle are adjustable to adapt to multi-specification packaging product rinsing requirements.
10. Automatic Liquid Leakage Monitoring System
Built-in high-sensitivity chemical and water leakage real-time monitoring device. It can automatically detect equipment liquid leakage faults, trigger alarm and protection mechanisms in time, ensure equipment operation safety and factory production safety.
11. Optional Chemical Concentration Auto Compensation System
Support optional real-time chemical concentration detection and automatic compensation function. The system automatically adjusts the concentration of cleaning agent according to production consumption, keeps the flux cleaning capacity stable, and reduces manual detection and calibration work.
12. Optional SECS/GEM Factory Automation Software
Reserved SECS/GEM software interface (optional), which can be seamlessly connected with intelligent factory MES system, realizing remote data transmission, equipment status monitoring and automated production management, suitable for high-end smart semiconductor production lines.
Process Flow & Machine Layout
fc730 inline cleaning machine advanced packaging cleaning machine layout
Certificate
Our factory is certified with ISO9001 standards, and meets the requirements for CE safety certification.
Why Choose us
ACTSPRAY provides midle-high-class cleaning equipment solutions for the SMT and semiconductor industries.
– We have advanced and automated cleaning and drying technologies for perfect cleaning results.
– We made standard machines & custom solutions fully meet varied production needs.
– We have professional after-sales team provides all-round reliable support.
– We own proven rich experience in serving mainstream semiconductor manufacturers worldwide.
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