GC860 SIP Inline Zero Wastewater Cleaning Machine

Zero-Wastewater Inline Cleaning System for SIP Module Flux Removal

The ACTSPRAY GC860 SIP Inline Zero Wastewater Cleaning Machine is an automated inline cleaning system specially designed for removing soldering flux residues from SIP (System-in-Package) modules after assembly and soldering.

Unlike conventional aqueous cleaning systems that require large quantities of DI water for final rinsing and generate rinse wastewater, GC860 uses a closed-loop water-based cleaning and rinsing process with evaporation and condensation recovery technology. The cleaning and rinsing liquids are continuously recovered and reused, significantly reducing liquid consumption and eliminating conventional rinse wastewater discharge.

The system integrates pre-cleaning, multi-stage chemical cleaning, chemical isolation, multi-stage rinsing, air cutting and hot air drying into one continuous automated process.

During cleaning, heated water-based cleaning chemistry softens and chemically breaks down flux residues, while high-pressure spray action physically removes the contaminants from component surfaces, solder pads and PCB areas. Multiple rinsing stages then remove remaining residues before air cutting and hot air drying complete the process.

A dedicated U-shaped condensation recovery system is installed above the cleaning and rinsing sections. Vapors generated during operation are condensed and recovered, allowing a large portion of the cleaning and rinsing liquid to be returned to the process.

This design can reduce liquid consumption by approximately 50% compared with conventional condensation methods, depending on operating conditions, while supporting a zero-rinse-wastewater cleaning process.

Key Applications

GC860 is primarily designed for automated cleaning of SIP modules after soldering and assembly.

Typical applications include:

SIP Module Cleaning
SIP Flux Cleaning
SIP Assembly Cleaning
System-in-Package Cleaning
Semiconductor Packaging Cleaning
Advanced Packaging Cleaning
Post-Soldering Flux Removal
Low-Standoff Package Cleaning
Electronic Module Cleaning
High-Reliability Electronics Cleaning

Typical Contaminants

GC860 is designed to remove soldering-related residues such as:

Solder flux
Flux residues
Organic process residues
Water-soluble process contaminants
Residues around soldered components and pads

The cleaning chemistry should be selected according to the customer’s flux type, component materials and required cleanliness level.

Zero-Wastewater Cleaning Technology

Closed-Loop Cleaning and Rinsing

One of the key advantages of GC860 is its closed-loop cleaning and rinsing process.

Both the cleaning liquid and rinsing liquid use the same type of environmentally friendly water-based chemistry.

Instead of continuously consuming fresh DI water and discharging contaminated rinse water, the system uses internal circulation, overflow, evaporation and condensation recovery to reduce liquid consumption.

Process Principle

Cleaning Liquid → Rinse Process → Contaminated Liquid Recovery → Evaporation → Condensation → Liquid Recovery → Reuse

The rinsing liquid flows from the rear section toward the front section through controlled overflow.

Contaminated liquid discharged from the rinsing process is internally evaporated and condensed. The recovered liquid is then returned to the rinsing process.

When the cleaning liquid level is insufficient, cleaning solution can be replenished from the overflow area between the cleaning and rinsing sections.

This closed-loop architecture eliminates the need for conventional DI water rinsing and helps achieve a zero-rinse-wastewater cleaning process.

Cleaning Process

The complete GC860 process is:

Loading → Pre-Cleaning → Cleaning 1 → Cleaning 2 → Chemical Isolation → Pre-Rinse → Rinse 1 → Rinse 2 → Rinse 3 → Air Cutting & Drying → Hot Air Drying → Unloading

1. Pre-Cleaning

The pre-cleaning section provides initial removal of flux residues and surface contaminants.

Heated cleaning liquid and spray pressure work together to soften and loosen flux residues before the main cleaning stages.

2. Cleaning 1 & Cleaning 2

Two dedicated cleaning stages provide intensive flux removal.

The combination of:

Heated water-based cleaning chemistry
Chemical decomposition
High-pressure spray impact
Upper and lower spray coverage

helps remove flux residues from solder pads, component surfaces and difficult-to-access areas.

Cleaning temperature, spray pressure and spray angle can be adjusted according to the product and cleaning chemistry.

3. Chemical Isolation

The chemical isolation section uses adjustable air knives to minimize cleaning liquid carryover into the subsequent rinse stages.

Both air pressure and air knife angle can be adjusted.

4. Pre-Rinse

The pre-rinse stage removes residual cleaning chemistry before the main rinse stages.

5. Rinse 1, Rinse 2 & Rinse 3

Three-stage rinsing provides progressive removal of remaining flux and cleaning residues.

The rinse liquid is continuously refreshed through rear-to-front overflow.

Unlike conventional DI water rinse systems, GC860 recovers the contaminated liquid through its internal evaporation and condensation system, significantly reducing liquid consumption.

6. Air Cutting & Drying

Air cutting removes residual rinse liquid from the SIP module surface before the final thermal drying stage.

7. Hot Air Drying

The final hot air drying section removes remaining moisture and delivers a dry SIP module to the downstream production process.

The hot air temperature is adjustable up to 100°C.

Key Features

1. Zero-Rinse-Wastewater Process

GC860 is designed around a closed-loop cleaning and rinsing system that does not require conventional DI water rinsing.

The system recovers contaminated rinse liquid through evaporation and condensation, allowing the recovered liquid to be reused.

This greatly reduces liquid consumption and eliminates conventional rinse wastewater discharge.

2. U-Shaped Condensation Recovery System

Specially designed U-shaped condensers are installed above both the cleaning and rinsing sections.

Process vapors pass through the condensers, where a large portion of the vapor is condensed and recovered.

The special condensation recovery system can reduce cleaning liquid consumption by approximately 50% compared with conventional condensation methods, depending on actual process conditions.

3. Water-Based Environmentally Friendly Chemistry

GC860 uses water-based environmentally friendly cleaning and rinsing chemistry.

The same type of water-based liquid can be used in both the cleaning and rinsing process, simplifying liquid management and supporting the closed-loop cleaning concept.

4. Multi-Stage Spray Cleaning

The cleaning and rinsing sections use upper and lower spray manifolds.

Spray pressure and spray manifold angles can be adjusted according to the SIP module design and contamination requirements.

5. Variable-Frequency Spray Pressure Control

Cleaning and rinsing spray pressure can be adjusted through variable-frequency control.

Electronic pressure monitoring provides real-time process monitoring and alarm functions.

6. Adjustable Chemical Isolation Air Knives

The chemical isolation section provides adjustable:

Air pressure
Air knife angle

This helps reduce cleaning liquid carryover and improves separation between cleaning and rinsing stages.

7. Full SUS304 Stainless Steel Construction

The machine is constructed using 100% SUS304 stainless steel.

The material provides:

Corrosion resistance
High-temperature resistance
High-pressure liquid resistance
Mechanical durability
Long service life

8. PC + PLC Control

The GC860 uses PC + PLC control with a Windows 10-based bilingual interface.

Operators can monitor and adjust major process parameters through the control system.

9. Real-Time Pressure Monitoring

Electronic pressure monitoring continuously monitors the pressure of the cleaning, rinsing and air systems.

Abnormal pressure conditions can trigger alarms for process protection.

10. Leakage Detection

Automatic leakage detection is provided for both the cleaning and rinsing sections.

The system can detect abnormal liquid leakage and generate an alarm.

11. Multi-Level Safety Protection

The GC860 includes:

High and low liquid level protection
Over-temperature protection
Electrical over-current protection
Electrical overload protection
Phase-loss protection
Phase-sequence protection
Emergency stop protection
Leakage detection

Emergency stop buttons are installed at the machine inlet, outlet and operator control panel.

12. Three-Layer Leak Protection

The cleaning and rinsing sections use a three-layer protection structure to reduce the risk of liquid leakage and help reduce operating noise.

13. Insulated Heating Sections

The heating sections use double-layer protection with built-in thermal insulation material.

This improves thermal insulation and helps reduce external surface temperature and operating noise.

14. SMEMA Connectivity

Standard SMEMA signal lines allow GC860 to connect with upstream and downstream equipment.

The system can be integrated with:

PCB/SIP loading equipment
PCB/SIP unloading equipment
Transfer conveyors
Automated production lines

15. MES Connectivity

Optional MES software allows the machine to communicate with the customer’s manufacturing execution system.

MES integration can support:

Machine status monitoring
Production management
Process traceability
Equipment data collection

16. Automatic Product Detection

Sensors at the machine inlet and outlet provide:

Product detection
Product counting
Input/output tracking
Timeout detection
Blockage alarm
Energy-saving standby

17. Energy-Saving Mode

The machine provides an energy-saving mode to reduce power and utility consumption during standby or low-production conditions.

Basic Technical Specifications

Item	Specification
Model	GC860
Brand	ACTSPRAY
Maximum Product Size	L400 × W600 × H100 mm
Conveyor Mesh Width	600 mm
Conveyor Speed	0.1–1.5 m/min
Transfer Direction	Left to Right
Conveyor Height	920 ± 25 mm
Cleaning Liquid Temperature	RT–80°C
Pre-Rinse Liquid Temperature	RT–60°C
Rinse Liquid Temperature	RT–60°C
Hot Air Drying Temperature	RT–100°C
PCW Supply	<15°C
PCW Flow Rate	100–120 L/min
PCW Pressure	>0.3 MPa
Exhaust Air Volume	60 m³/min
Total Power	202 kW
Power Supply	AC 380 V, 3 Phase, 50 Hz
Rated Current	350 A
Compressed Air Supply	0.5–0.7 MPa
Compressed Air Consumption	200 L/min
Machine Dimensions	Approx. L8600 × W1850 × H1920 mm
Machine Weight	Approx. 5200 kg
Control System	PC + PLC
Operation Interface	Windows 10, Chinese / English
SMEMA Interface	Standard
MES Connection	Optional

RT = Room Temperature. Final machine dimensions are subject to the approved equipment layout. Actual process parameters may be optimized according to SIP design, flux type, cleaning chemistry and required cleanliness level.

Why Choose the GC860?

The GC860 SIP Inline Zero Wastewater Cleaning Machine is designed for manufacturers looking to reduce water consumption and wastewater treatment requirements while maintaining reliable flux removal performance.

Its combination of heated chemical spray cleaning, multi-stage rinsing, closed-loop liquid recovery, condensation technology and hot air drying provides a complete automated SIP cleaning process.

The integrated condensation recovery system recovers cleaning and rinsing liquid from process vapors, while the closed-loop rinse process significantly reduces liquid consumption and eliminates conventional rinse wastewater discharge.

With inline conveyor transport, SMEMA connectivity and optional MES integration, GC860 can be incorporated directly into automated SIP module production lines.

Key Benefits

Zero Rinse Wastewater

Closed-loop rinsing and evaporation-condensation recovery eliminate conventional DI water rinse wastewater.

Reduced Liquid Consumption

The dedicated U-shaped condensation recovery system can reduce cleaning liquid consumption by approximately 50% compared with conventional condensation methods, depending on operating conditions.